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Cpu Maker
  1. AMD 7 items
  2. Intel 9 items
  3. MediaTek 1 item
  4. NXP 1 item
  5. Qualcomm 4 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 3 items
  3. range > 25 W 7 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 3 items
  3. Espressif ESP32-D0WD 1 item
  4. Intel® Atom™ 4 items
  5. Intel® Celeron® 2 items
  6. Intel® Core™ 7 items
  7. Intel® Pentium® 1 item
  8. Intel® Xeon® 1 item
  9. MediaTek Genio 510 1 item
  10. NXP i.MX 8M 1 item
  11. Qualcomm® QCS5430 1 item
  12. Qualcomm® QCS6490 1 item
  13. Rockchip RK3588 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥1 22 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 13 items
  2. COM-HPC® 2 items
  3. Qseven 1 item
  4. Single Board Compute 1 item
  5. SMARC 5 items
  6. Single Board Computer 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 13 items
  3. ≤ 80 x 80mm 2 items
  4. ≥ 100 x 100mm 4 items
  5. COM Express® 3 items
Form Factor Specification
  1. COM Express Basic 4 items
  2. COM Express Compact 9 items
  3. COM-HPC Client 1 item
  4. Other SBCs 2 items
  5. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 15 items
  2. memory ≤16 9 items
  3. memory ≤2 14 items
  4. memory ≤4 15 items
  5. memory ≤8 14 items
  6. memory ≥32 9 items
  7. soldered down 8 items
  8. SO_DIMM 14 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 6 items
  3. M.2 SATA SSD slot 2 items
  4. microSD card slot 3 items
  5. onboard eMMC 6 items
  6. onboard eMMC 5 items
  7. SATA channels ≥ 1 11 items
  8. SATA channels ≥ 1 4 items
  9. SATA channels ≥ 2 3 items
  10. SATA channels ≥ 2 10 items
  11. SATA channels ≥ 3 1 item
  12. SATA channels ≥ 4 1 item
  13. SD interface 2 items
  14. SD interface 2 items
  15. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 15 items
  4. 0°C ÷ +50°C 14 items
  5. 0°C ÷ +60°C 22 items
  6. 20°C ÷ +70°C 11 items
  7. -20°C ÷ +70°C 3 items
  8. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 15 items
  2. PCI-e lanes ≥ 2 14 items
  3. PCI-e lanes ≥ 3 12 items
  4. PCI-e lanes ≥ 4 13 items
  5. PCI-e lanes ≥ 5 13 items
Ttl Uarts
  1. TTL Uarts ≥1 18 items
  2. TTL Uarts ≥2 23 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 17 items
  2. USB 2.0 ≥ 2 15 items
  3. USB 2.0 ≥ 3 15 items
  4. USB 2.0 ≥ 4 15 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 14 items
  7. USB 3.0 ≥ 1 10 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 8 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 7 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB 4.0 ≥ 2 1 item
  16. USB CLIENT 1 item
  17. USB OTG 2 items
Video Interfaces
  1. DDI 15 items
  2. DP 23 items
  3. DP++ 13 items
  4. DUAL CHANNEL LVDS 34 items
  5. eDP 34 items
  6. HDMI 34 items
  7. MIPI-CSI camera conn 11 items
  8. MIPI-DSI 11 items
  9. PARALLEL RGB 5 items
  10. SINGLE CHANNEL LVDS 32 items
  11. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. ONBOARD WI-FI/BLE 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
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  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions