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SOM-COMe-CT6-TWL
Aspectos destacados
GraphicsIntegrated Intel® Gen12 UHD graphics controller with up to 32 EU
MemoryOne SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB
COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)
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Inicie su evaluación
Las actividades de prueba y desarrollo en fases tempranas pueden apoyarse mediante una configuración de evaluación limitada basada en el SOM-COMe-CT6-ADL-N de la generación anterior, lo que permite una validación anticipada de la arquitectura de la plataforma y de la compatibilidad del software antes de la disponibilidad del módulo TWL. Nuestros expertos están disponibles para ayudarle a evaluar el SOM-COMe-CT6-ADL-N y a planificar una transición fluida al módulo TWL cuando esté disponible.
CONTÁCTENOS
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Application Hub
Descubre las aplicaciones compatibles con este producto disponibles en SECO Application Hub: soluciones listas para usar para acelerar el desarrollo e implementación de funciones inteligentes.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
Descripción
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COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90) |
|---|---|
CPU Description
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Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Twin Lake): Intel® Core™ i3-N355 – 8 Cores @1.9 GHz (3.9 GHz Turbo), 15W TDP Intel® Processor N250 – 4 Cores @1.3 GHz (3.8 GHz Turbo), 6W TDP Intel® Processor N150 – 4 Cores @0.8 GHz (3.6 GHz Turbo), 6W TDP |
Memory Description
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One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
|
Graphics Description
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Integrated Intel® Gen12 UHD graphics controller with up to 32 EU |
Video Interfaces Description
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2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C |
Video Resolution Description
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HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b |
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Mass Storage Description
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Up to 2x S-ATA Gen3 channels |
Networking Description
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1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN |
USB Description
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Up to 2x USB 10Gbps |
PCI Description
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Up to 6x PCI-e Gen3 lanes |
Audio Description
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HD Audio interface |
Serial Ports
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2x UARTs |
Other Interfaces
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SPI, 2x I2C, SM Bus, Thermal Management, FAN management |
|
Power Supply
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+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
Operating System
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Microsoft® Windows 10 IoT Enterprise 2019 LTSC |
Operating Temperature Description
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0°C ÷ +60°C (Commercial version)
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions
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95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |
Número de parte
COM Express 3.1 Twin Lake Intel® Core i3-N355, 2x PCIe x2 + SATA0/1, eMMC 128GB, eDP, USB HUB, TPM SLB 9670 Q2.0, LPC - Comm. Temp
COM Express 3.1 Twin Lake Intel® N250, 2x PCIe x2 + SATA0/1, LVDS, USB HUB, TPM SLB 9670 Q2.0, eSPI - Comm. Temp
COM Express 3.1 Twin Lake Intel® N150, 2x PCIe x2 + SATA0/1, eDP, USB HUB, TPM 2.0, eSPI - Comm. Temp
COM Express 3.1 Twin Lake Intel® N150, 2x PCIe x2 + SATA0/1, eDP, no USB HUB, eSPI - Comm. Temp
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