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SOM-COM-HPC-A-TGL-UP3Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Core™ y Celeron® de 11.ª generación (Codename: Tiger Lake-UP3). (CARINA - C77)x86 Computer on Module COM-HPC® Procesadores Intel -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Computer on Module COM-HPC® Procesadores Intel AI-Optimized Hardware -
SBC-3.5-RK35683.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)Arm Procesadores Rockchip Single Board Computer (SBC) 3.5-inch SBC -
Carrier-Trizeps-pConXSCarrier Board for Trizeps SODIMM SOMsKits de desarrollo y accesorios Placa portadora Trizeps Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards Trizeps Carrier Boards -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® Procesadores AMD -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Procesadores Intel