es
de 
en 
fr 
it 
jp 
ru 
zh 
SOM-COM-HPC-A-TGL-UP3
Aspectos destacados
GraphicsIntel® Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays
MemoryTwo DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Descubre las aplicaciones compatibles con este producto disponibles en SECO Application Hub: soluciones listas para usar para acelerar el desarrollo e implementación de funciones inteligentes.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
DEV-KIT-COM-HPC-A
Descripción
|
Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Core™ y Celeron® de 11.ª generación (antes Tiger Lake-UP3) |
|---|---|
CPU Description
|
11th Generation Intel® Core™ and Celeron® Processors, also available in industrial temperature range |
|
Max Cores
|
4 |
Memory Description
|
2x DDR4-3200 SODIMM Slots with IBECC (In-Band Error Correction Code), up to 64GB supported |
Graphics Description
|
Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units |
Video Interfaces Description
|
1x eDP 1.4b or MIPI_DSI 1.3 |
Video Resolution Description
|
DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
|
Mass Storage Description
|
2 x S-ATA Gen3 Channels |
Networking Description
|
Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers |
USB Description
|
Up to 4 x USB 4.0 / USB 3.2 Host ports |
PCI Description
|
1x PCI-e x4 Gen 4 port |
Audio Description
|
SoundWire and I2S Audio Interface |
Serial Ports
|
2 x UARTs |
Other Interfaces
|
2x 4-lane CSI-2 interfaces, optional |
|
Power Supply
|
+8VDC .. +20VDC Main power supply |
Operating System
|
Windows 10 IoT Enterprise LTSC |
Operating Temperature Description
|
0°C ÷ +60°C (Commercial version) |
Dimensions
|
120 x 95 mm (Com HPC Size A Form factor, Client pinout) |
Número de parte
COM-HPC - CARINA w/Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) 12MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
COM-HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/ Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
COM-HPC - CARINA w/ Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
COM-HPC - CARINA w/Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
Accessories