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Advantages of the Computer-on-Module Approach
Hardware design investment limited to the carrier board
Scalable and future-proof solution
Long-term availability of modules in standard form factors
ARM and x86 compatibility
Multi-vendor solution
Reduced time-to-market
Description
Carried boards are paired with modules and are essential for completing a project, as they house the application’s specific connectivity and the multimedia interfaces.
The use of a carrier board + module solution is advantageous in many cases, modularizing the project and allowing it to be adapted over time to new requirements through the substitution of just one of the two parts.
SECO carried boards have been developed for various standard form factors. Often included in the Development Kit, they are ideal for rapid product prototyping.
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Carrier-Trizeps-pConXS-IIISODIMM 200 Carrier Board for SOM-Trizeps -
Carrier-Trizeps-pConXSCarrier Board for Trizeps SODIMM SOMs -
Carrier-Trizeps-iP5-BaseCarrier Board for Trizeps SODIMM SOMs -
Carrier-Trizeps-ConXTCarrier Board for SOM-Trizeps-VII-MX6 -
Carrier-Myon-ConXMMicroModule Carrier Board for SOM-Myon-I-410E -
Carrier-COMe-T6-E10Carrier Board for COM-Express® Rel. 3.1 Type 6 Modules for Development -
Carrier-COMe-T6-C30Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor -
Carrier-Q7-D59Carrier Board for Qseven® Rel. 2.0 / 2.1 Compliant Modules in the 3.5” Form Factor. (Formerly CQ7-D59 ) -
Carrier-Q7-D03Carrier Board for Qseven® and μQseven® Rev 2.1 Modules in embedded NUC™ Form factor . (Formerly CQ7-D03 )
