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Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. CALYPSO
    CALYPSO
    COM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
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  2. ATLAS
    ATLAS
    Qseven® Rel. 2.1 compliant module with Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake)
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  3. ELECTRA
    ELECTRA
    μQseven® module with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
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  4. ARCALIS
    ARCALIS
    Qseven® Rel. 2.1 module with NXP i.MX 8X Applications Processors
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  5. MAIA
    MAIA
    Qseven® Rel. 2.1 module with NXP i.MX 8 Applications Processors
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  6. MIRA
    MIRA
    Qseven® Rel. 2.1 module with NXP i.MX 8M Applications Processors
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  7. NAOS
    NAOS
    Qseven® Rel. 2.1 module with Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
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  8. NEMBUS
    NEMBUS
    μQseven® module with NXP i.MX 6 Processors
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  9. KUMA
    KUMA
    μQseven Rel. 2.0 module with Intel® Atom™ E3800 and Celeron® (formerly Bay Trail) Processors
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  10. ASTERION
    ASTERION
    Qseven® Rel. 2.0 module with Intel® Atom™ E3800 and Celeron® (formerly Bay Trail) Processors
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Cpu Power Consumption
  1. range 10-25 W 19 item
  2. range < 10 W 26 item
  3. range < 5 W 7 item
  4. range > 25 W 6 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 1 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series  1 item
  5. AMD® Ryzen™ embedded V-Series™ 2 item
  6. Intel® Atom™ 12 item
  7. Intel® Celeron® 14 item
  8. Intel® Core™  7 item
  9. Intel® Pentium®  6 item
  10. Intel® Xeon® 3 item
  11. NVIDIA Tegra® T30  1 item
  12. NXP i.MX 8M 3 item
  13. NXP i.MX 8M Mini 3 item
  14. NXP i.MX 8M Nano 2 item
  15. NXP i.MX 8M Plus 2 item
  16. NXP i.MX 8X 2 item
  17. NXP i.MX6  5 item
  18. NXP i.MX8  1 item
  19. Qualcomm Snapdragon 1 item
  20. Texas Instruments® OMAP™ 37xx  1 item
  21. Xilinx® Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 41 item
  2. ETHERNET≥2 10 item
Form Factor
  1. COM Express® 13 item
  2. COM-HPC® 3 item
  3. ETX®  1 item
  4. Qseven 16 item
  5. SMARC 6 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 4 item
  3. 48,5 x 32,5 mm 2 item
  4. 67,6 x 36,7 mm 5 item
  5. ≤ 100 x 100mm 29 item
  6. ≤ 80 x 80mm 22 item
  7. ≥ 100 x 100mm 5 item
Form Factor Specification
  1. COM Express Basic 5 item
  2. COM Express Compact 8 item
  3. COM-HPC Client 2 item
  4. Qseven 70x70 mm 12 item
  5. µQseven 70x40 4 item
Mass Storage
  1. CFAST slot 2 item
  2. M.2 NVMe SSD slot 2 item
  3. microSD card slot  6 item
  4. onboard eMMC 32 item
  5. onboard SSD 2 item
  6. PATA channel 2 item
  7. SATA channels ≥ 1 26 item
  8. SATA channels ≥ 2  23 item
  9. SATA channels ≥ 3 4 item
  10. SATA channels ≥ 4 2 item
  11. SD interface  22 item
Memory
  1. soldered down 24 item
  2. SO_DIMM 14 item
  3. ≤1 40 item
  4. ≤16 12 item
  5. ≤2 38 item
  6. ≤4 34 item
  7. ≤8 24 item
  8. ≥32 10 item
Operating Temperature
  1. -20°C ÷ +60°C 24 item
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 35 item
  4. 0°C ÷ +50°C 30 item
  5. 0°C ÷ +60°C 37 item
  6. 20°C ÷ +70°C 24 item
Pci Express
  1. PCI-e lanes ≥ 1 36 item
  2. PCI-e lanes ≥ 2 26 item
  3. PCI-e lanes ≥ 3 21 item
  4. PCI-e lanes ≥ 4 19 item
  5. PCI-e lanes ≥ 5 12 item
Ttl Uarts
  1. ≥1 34 item
  2. ≥2 30 item
  3. ≥3 12 item
USB
  1. USB 2.0 ≥ 1  38 item
  2. USB 2.0 ≥ 2  36 item
  3. USB 2.0 ≥ 3 30 item
  4. USB 2.0 ≥ 4 28 item
  5. USB 2.0 ≥ 5 21 item
  6. USB 2.0 ≥ 6 20 item
  7. USB 3.0 ≥ 1 21 item
  8. USB 3.0 ≥ 2 17 item
  9. USB 3.0 ≥ 3 8 item
  10. USB 3.0 ≥ 4 8 item
  11. USB 3.1 ≥ 1 5 item
  12. USB 3.1 ≥ 2 5 item
  13. USB 3.2 ≥ 1 2 item
  14. USB 3.2 ≥ 2 2 item
  15. USB 4.0 ≥ 1 3 item
  16. USB 4.0 ≥ 2 3 item
  17. USB 4.0 ≥ 3 2 item
  18. USB 4.0 ≥ 4 2 item
  19. USB CLIENT 4 item
  20. USB OTG 15 item
Video Interfaces
  1. DDI 9 item
  2. DP 13 item
  3. DP++ 10 item
  4. DUAL CHANNEL LVDS 30 item
  5. eDP 23 item
  6. HDMI 28 item
  7. MIPI-CSI camera connector 4 item
  8. MIPI-DSI 10 item
  9. PARALLEL RGB 5 item
  10. SDVO 2 item
  11. SINGLE CHANNEL LVDS 35 item
  12. VGA 6 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 1 item
  2. ONBOARD WI-FI/BLE 6 item