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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. SBC-pITX-APL
    SBC-pITX-APL
    Pico-ITX SBC with Intel® Atom® X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ADLER - C41)
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  2. SBC-3.5-MX8
    SBC-3.5-MX8
    3.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)
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  3. SBC-3.5-MX8X
    SBC-3.5-MX8X
    3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)
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  4. SBC-3.5-MX8M-Mini
    SBC-3.5-MX8M-Mini
    3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61)
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  5. SBC-3.5-PX30
    SBC-3.5-PX30
    3.5” SBC with Rockchip PX30 SoC. (JUNO - D23)
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  6. SBC-3.5-RK3568
    SBC-3.5-RK3568
    3.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)
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  7. DEV-KIT-COM-HPC-A
    DEV-KIT-COM-HPC-A
    Cross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules
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  8. SOM-SMARC-EHL
    SOM-SMARC-EHL
    SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93)
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  9. DELTA [Discontinued]
    DELTA [Discontinued]
    Qseven® module with NVIDIA® Tegra® T30 Processor
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  10. Modular Vision 7 MX93
    Modular Vision 7 MX93
    Entry level seven inch HMI based on NXP i.MX93
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Cpu Power Consumption
  1. range 10-25 W 20 item
  2. range < 10 W 31 item
  3. range < 5 W 6 item
  4. range > 25 W 9 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 2 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series  1 item
  5. AMD® Ryzen™ embedded V-Series™ 4 item
  6. Intel® Atom™ 23 item
  7. Intel® Celeron® 24 item
  8. Intel® Core™  11 item
  9. Intel® Pentium®  14 item
  10. Intel® Xeon® 2 item
  11. MediaTek Genio 510 1 item
  12. MediaTek Genio 700 1 item
  13. NVIDIA Tegra® T30  1 item
  14. NXP i.MX 8M 6 item
  15. NXP i.MX 8M Mini 7 item
  16. NXP i.MX 8M Nano 3 item
  17. NXP i.MX 8M Plus 1 item
  18. NXP i.MX 8X 1 item
  19. NXP i.MX 93 2 item
  20. NXP i.MX 933/935 1 item
  21. NXP i.MX 95 1 item
  22. NXP i.MX6  18 item
  23. NXP i.MX8  3 item
  24. Qualcomm Snapdragon 1 item
  25. Qualcomm® QCS5430 1 item
  26. Qualcomm® QCS6490 1 item
  27. Rockchip PX30 1 item
  28. Rockchip RK3399 5 item
  29. Rockchip RK3568 1 item
  30. Zynq® Ultrascale+™  1 item
Form Factor
  1. Boxed Solutions 11 item
  2. COM Express® 14 item
  3. COM-HPC® 2 item
  4. Modular HMIs 14 item
  5. Qseven 12 item
  6. Single Board Computer  24 item
  7. SMARC 11 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 4 item
  3. 48,5 x 32,5 mm 2 item
  4. 67,6 x 36,7 mm 4 item
  5. ≤ 100 x 100mm 34 item
  6. ≤ 80 x 80mm 18 item
  7. ≥ 100 x 100mm 33 item
Form Factor Specification
  1. 3,5" 8 item
  2. COM Express Basic 5 item
  3. COM Express Compact 9 item
  4. COM-HPC Client 2 item
  5. embedded NUC 1 item
  6. Other Single Board Computers 9 item
  7. Pico-ITX 4 item
  8. Qseven 70x70 mm 8 item
  9. µQseven 70x40 4 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 7 item
  3. M.2 SATA SSD slot 11 item
  4. microSD card slot  22 item
  5. mSATA half-size slot 2 item
  6. onboard eMMC 79 item
  7. onboard SSD 5 item
  8. SATA channels ≥ 1 37 item
  9. SATA channels ≥ 2  24 item
  10. SATA channels ≥ 3 4 item
  11. SATA channels ≥ 4 3 item
  12. SD interface  33 item
  13. standard SATA connector 6 item
Memory
  1. soldered down 48 item
  2. SO_DIMM 21 item
  3. ≤1 86 item
  4. ≤16 20 item
  5. ≤2 74 item
  6. ≤4 64 item
  7. ≤8 50 item
  8. ≥32 17 item
Operating Temperature
  1. -20°C ÷ +60°C 39 item
  2. -20°C ÷ +70°C 11 item
  3. -40°C ÷ +85°C 45 item
  4. 0°C ÷ +50°C 70 item
  5. 0°C ÷ +60°C 78 item
  6. 20°C ÷ +70°C 36 item
Pci Express
  1. PCI-e lanes ≥ 1 39 item
  2. PCI-e lanes ≥ 2 32 item
  3. PCI-e lanes ≥ 3 25 item
  4. PCI-e lanes ≥ 4 23 item
  5. PCI-e lanes ≥ 5 14 item
Ttl Uarts
  1. ≥1 45 item
  2. ≥2 42 item
  3. ≥3 17 item
USB
  1. USB 2.0 ≥ 1  82 item
  2. USB 2.0 ≥ 2  71 item
  3. USB 2.0 ≥ 3 47 item
  4. USB 2.0 ≥ 4 38 item
  5. USB 2.0 ≥ 5 26 item
  6. USB 2.0 ≥ 6 23 item
  7. USB 3.0 ≥ 1 39 item
  8. USB 3.0 ≥ 2 30 item
  9. USB 3.0 ≥ 3 11 item
  10. USB 3.0 ≥ 4 8 item
  11. USB 3.1 ≥ 1 9 item
  12. USB 3.1 ≥ 2 7 item
  13. USB 3.2 ≥ 1 7 item
  14. USB 3.2 ≥ 2 10 item
  15. USB 4.0 ≥ 1 2 item
  16. USB 4.0 ≥ 2 3 item
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 1 item
  19. USB CLIENT 1 item
  20. USB OTG 34 item
Video Interfaces
  1. DDI 12 item
  2. DP 33 item
  3. DP++ 23 item
  4. DUAL CHANNEL LVDS 42 item
  5. eDP 36 item
  6. HDMI 54 item
  7. MIPI-CSI camera connector 11 item
  8. MIPI-DSI 11 item
  9. PARALLEL RGB 3 item
  10. SINGLE CHANNEL LVDS 42 item
  11. VGA 4 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 23 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 9 item
  3. M.2 Socket 2 key B (SSD) 8 item
  4. ONBOARD WI-FI/BLE 17 item
Installation Depth
  1. 30-35 4 item
  2. 35-40 5 item
  3. 40-45 1 item
  4. >45 6 item
Screen Dimension
  1. <8 7 item
  2. 10-14 8 item
  3. 14-19 3 item
  4. >20 1 item