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Description
Products optimized for artificial intelligence with specialized accelerators such as TPUs and NPUs.
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SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80) -
SOM-SMARC-MX93SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors. (MAURY) -
Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS -
SBC-3.5-RK35683.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09) -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77) -
SOM-COM-HPC-A-TGL-HCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57) -
SOM-COM-HPC-A-ADL-PCOM-HPC® Client Computer on Module (CoM) Size A with 12th Gen Intel® Core™ (Codename: Alder Lake - P series) Processors. (ORION - D80) -
SOM-COMe-BT6-RPL-PCOM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03) -
SOM-SMARC-MX8M-PlusSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8M Plus Applications Processors. (LEVY - D18)