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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.
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SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U) -
Palladio 400 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
Palladio 500 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77) -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80) -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC) -
Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS -
SBC-3.5-TGL-UP3SBC 3.5” with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake-UP3). (PRISMA - D64)
