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Titan 300 TGL-UP3
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
Cpu
11th Gen Intel® Core™ processors and Intel® Celeron® SoCs
Graphics
Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
Connectivity
2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
Memory
Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
Product details
Description
|
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3) |
|---|---|
Cpu
|
Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) |
|
Max Cores
|
4 |
|
Memory
|
2x DDR4-3200 SODIMM slots |
|
Graphics
|
Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
Video Interfaces
|
2x Multimode DisplayPort 1.4, on dual DP++ connector |
Video Resolution
|
DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
Mass Storage
|
On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB |
Networking
|
2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request |
Usb
|
2x Superspeed USB 10Gbps ports on Dual Type-A sockets |
Audio
|
Lineout + MicIn combo TRRS Audio Jack |
Serial Ports
|
2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
Other Interfaces
|
Optional 2x 12 poles terminal block connectors with the
Power ON Button |
Power Supply
|
12VDC to 24VDC range, Mega-Fit 2p RA Connector |
Operating System
|
Microsoft® Windows 10 IoT Enterprise LTSC |
Operating Temperature
|
Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
*The values indicated refer to the maximum temperature of the environment of use of the device. It is the customer’s responsibility to verify that the temperature remains within the admissible range indicated in this manual and, if necessary, adopt any passive cooling solution together with an application-dependent cooling system that can ensure that the heat sink temperature will not damage the device itself and/or the connected mechanical parts. |
Dimensions
|
199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives) |
| SYS-D64-IPC-5331-1202-E0 | Part Number Description Standard IPC system with SBC-D64-3.5"- Intel i5-1145GRE 2.6GHz 4c-8GB RAM-256GBSSD-Linux -Ext.Temp | |
| SYS-D64-IPC-6331-1202-C0 | Part Number Description Standard IPC system with SBC-D64-3.5"- Intel i3-1115G4E 3GHz 2c-8GB RAM-256GBSSD-Linux -Comm.Temp | |
| SYS-D64-IPC-2651-1202-E0 | Part Number Description Standard IPC system with SBC-D64-3.5"- Intel i7-1185GRE 2.8GHz 4c-2x16GB RAM-512GBSSD-Linux -Ext.Temp | |
| SYS-D64-IPC-4111-1202-C0 | Part Number Description Standard IPC system with SBC-D64-3.5"- Intel 6305E 1.8GHz 2c-4GB RAM-128GBSSD-Linux -Comm.Temp | |
| SYS-D64-IPC-2651-1202-E0 | Part Number Description Standard IPC system with SBC-D64-3.5"- Intel i7-1185GRE 2.8GHz 4c-2x16GB RAM-512GBSSD-Linux -Ext.Temp | |
| SYS-D64-IPC-4111-1202-C0 | Part Number Description Standard IPC system with SBC-D64-3.5"- Intel 6305E 1.8GHz 2c-4GB RAM-128GBSSD-Linux -Comm.Temp |
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