Titan 300 TGL-UP3
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Product details
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Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3) |
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Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) |
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2x DDR4-3200 SODIMM slots |
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Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
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2x Multimode DisplayPort 1.4, on dual DP++ connector |
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DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
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On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB |
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2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request |
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2x Superspeed USB 10Gbps ports on Dual Type-A sockets |
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Lineout + MicIn combo TRRS Audio Jack |
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2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
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Optional 2x 12 poles terminal block connectors with the
Power ON Button |
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12VDC to 24VDC range, Mega-Fit 2p RA Connector |
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Microsoft® Windows 10 IoT Enterprise LTSC |
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Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
*The values indicated refer to the maximum temperature of the environment of use of the device. It is the customer’s responsibility to verify that the temperature remains within the admissible range indicated in this manual and, if necessary, adopt any passive cooling solution together with an application-dependent cooling system that can ensure that the heat sink temperature will not damage the device itself and/or the connected mechanical parts. |
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199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives) |
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