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人工智能优化硬件
人工智能优化硬件
描述
专为人工智能优化的产品,配备了专用加速器,如TPUs和NPUs。
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SOM-COM-HPC-A-RPL
COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
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类别
模块
50
COM Express®
15
COM-HPC®
4
Qseven®
11
SMARC
14
Myon MicroModule SOM
2
Trizeps SODIMM SOM
4
人工智能优化硬件
3
SBC
28
3.5"
9
嵌入式 NUC™
1
Other Form Factor SBC
10
Pico-ITX
3
Development Kits for Rapid POC
5
HMI 解决方案
20
的齐平式安装人机界面
3
的面板安装人机界面
4
的后部安装人机界面
3
Modular Vision HMI
3
FLEXY VISION
7
无风扇嵌入式计算机
16
Dev Kits, Carrier Boards and Accessories
153
配件
134
CAB Kit
11
Display Kit
3
Heat Spreaders
94
Other Accessories
20
Power Supply Kit
4
Wi-Fi Kit
2
载板
9
COM Express Carrier Boards
2
Qseven Carrier Boards
2
Myon Carrier Boards
1
Trizeps Carrier Boards
4
入门和开发套件
10
COM Express Development Kit
2
COM-HPC Development Kit
1
Qseven Development Kit
1
SMARC Development Kit
2
Trizeps Development Kit
2
Myon Development Kit
1
结构
97
Arm
50
x86
47
处理器
107
AMD Processor
8
Espressif
1
Intel Processor
46
Nvidia Processor
1
NXP Processor
43
Rockchip Processor
8
标准
56
3.5" Standard
8
COM Express Standard
14
COM-HPC Standard
4
Embedded NUC Standard
1
Pico-ITX Standard
4
Qseven Standard
8
SMARC Standard
13
μQseven Standard
4
支付系统
1
嵌入式计算机
1
TFT Display
1
过滤器
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Category
模块
50
COM Express®
15
COM-HPC®
4
Qseven®
11
SMARC
14
Myon MicroModule SOM
2
Trizeps SODIMM SOM
4
人工智能优化硬件
3
SBC
28
3.5"
9
嵌入式 NUC™
1
Other Form Factor SBC
10
Pico-ITX
3
Development Kits for Rapid POC
5
HMI 解决方案
20
的齐平式安装人机界面
3
的面板安装人机界面
4
的后部安装人机界面
3
Modular Vision HMI
3
FLEXY VISION
7
无风扇嵌入式计算机
16
Dev Kits, Carrier Boards and Accessories
153
配件
134
CAB Kit
11
Display Kit
3
Heat Spreaders
94
Other Accessories
20
Power Supply Kit
4
Wi-Fi Kit
2
载板
9
COM Express Carrier Boards
2
Qseven Carrier Boards
2
Myon Carrier Boards
1
Trizeps Carrier Boards
4
入门和开发套件
10
COM Express Development Kit
2
COM-HPC Development Kit
1
Qseven Development Kit
1
SMARC Development Kit
2
Trizeps Development Kit
2
Myon Development Kit
1
结构
97
Arm
50
x86
47
处理器
107
AMD Processor
8
Espressif
1
Intel Processor
46
Nvidia Processor
1
NXP Processor
43
Rockchip Processor
8
标准
56
3.5" Standard
8
COM Express Standard
14
COM-HPC Standard
4
Embedded NUC Standard
1
Pico-ITX Standard
4
Qseven Standard
8
SMARC Standard
13
μQseven Standard
4
支付系统
1
嵌入式计算机
1
TFT Display
1
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Cpu Type
Intel® Core™
1
项目
Ethernet
ETHERNET≥2
1
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Form Factor
COM-HPC®
1
项目
Form Factor Specification
COM-HPC Client
1
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Mass Storage
M.2 NVMe SSD slot
1
项目
SATA channels ≥ 2
1
项目
记忆
SO_DIMM
1
项目
≥32
1
项目
Operating Temperature
-40°C ÷ +85°C
1
项目
Pci Express
PCI-e lanes ≥ 5
1
项目
Ttl Uarts
≥2
1
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USB
USB 2.0 ≥ 4
1
项目
USB 3.2 ≥ 2
1
项目
USB 4.0 ≥ 4
1
项目
Video Interfaces
DDI
1
项目
DP++
1
项目
eDP
1
项目
HDMI
1
项目
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