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  1. Flexy Vision 7 APL
    Flexy Vision 7 APL
    Panel PC with 7.0” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors
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  2. Titan 225 RK3399
    Titan 225 RK3399
    Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)
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  3. Titan 235 APL
    Titan 235 APL
    Fanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC)
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  4. Titan 230 APL
    Titan 230 APL
    Fanless Embedded Computer with Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (HYDRUS - SYS-B68-IGW)
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  5. Titan 250 APL IP65
    Titan 250 APL IP65
    IP65 Fanless Embedded PC based on Intel® Atom® x5 (codename: Apollo Lake) Applications Processor. (CHAMALEON - SYS-B68-HEN)
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  6. SBC-SANTOKA-MX6
    SBC-SANTOKA-MX6
    Single Board Computer (SBC) based on NXP i.MX6 processor
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  7. SBC-eNUC-APL
    SBC-eNUC-APL
    embedded NUC™ SBC with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ALVIN - B68)
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  8. SBC-3.5-RK3399
    SBC-3.5-RK3399
    3.5” SBC with Rockchip RK3399 SoC. (SOLON - C31)
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  9. SBC-3.5-MX8
    SBC-3.5-MX8
    3.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)
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  10. SBC-3.5-MX8X
    SBC-3.5-MX8X
    3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)
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Cpu Power Consumption
  1. range 10-25 W 7 item
  2. range < 10 W 11 item
  3. range > 25 W 1 item
Cpu Type
  1. AMD® G-Series™ 1 item
  2. AMD® R-Series  1 item
  3. Intel® Atom™ 11 item
  4. Intel® Celeron® 11 item
  5. Intel® Core™  3 item
  6. Intel® Pentium®  8 item
  7. NXP i.MX 8M Mini 1 item
  8. NXP i.MX 8M Plus 1 item
  9. NXP i.MX 8X 2 item
  10. NXP i.MX 95 1 item
  11. NXP i.MX6  3 item
  12. NXP i.MX8  1 item
  13. Rockchip RK3399 4 item
  14. Zynq® Ultrascale+™  1 item
Form Factor
  1. Boxed Solutions 4 item
  2. COM-HPC® 2 item
  3. Modular HMIs 5 item
  4. Single Board Computer  9 item
  5. SMARC 7 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 8 item
  2. ≤ 80 x 80mm 5 item
  3. ≥ 100 x 100mm 13 item
Form Factor Specification
  1. 3,5" 5 item
  2. COM-HPC Client 1 item
  3. embedded NUC 1 item
  4. Pico-ITX 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 4 item
  3. M.2 SATA SSD slot 5 item
  4. microSD card slot  4 item
  5. onboard eMMC 25 item
  6. onboard SSD 2 item
  7. SATA channels ≥ 1 9 item
  8. SATA channels ≥ 2  2 item
  9. SD interface  8 item
  10. standard SATA connector 3 item
Memory
  1. soldered down 22 item
  2. SO_DIMM 4 item
  3. ≤1 26 item
  4. ≤16 5 item
  5. ≤2 24 item
  6. ≤4 23 item
  7. ≤8 16 item
  8. ≥32 2 item
Operating Temperature
  1. -20°C ÷ +60°C 10 item
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 14 item
  4. 0°C ÷ +50°C 24 item
  5. 0°C ÷ +60°C 22 item
  6. 20°C ÷ +70°C 10 item
Pci Express
  1. PCI-e lanes ≥ 1 12 item
  2. PCI-e lanes ≥ 2 9 item
  3. PCI-e lanes ≥ 3 6 item
  4. PCI-e lanes ≥ 4 6 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. ≥1 12 item
  2. ≥2 13 item
  3. ≥3 7 item
Video Interfaces
  1. DDI 1 item
  2. DP 9 item
  3. DP++ 15 item
  4. DUAL CHANNEL LVDS 13 item
  5. eDP 13 item
  6. HDMI 20 item
  7. MIPI-CSI camera connector 3 item
  8. MIPI-DSI 3 item
  9. SINGLE CHANNEL LVDS 11 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 11 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 4 item
  3. M.2 Socket 2 key B (SSD) 7 item
  4. ONBOARD WI-FI/BLE 8 item
Installation Depth
  1. 35-40 2 item
  2. >45 6 item
Screen Dimension
  1. <8 1 item
  2. 10-14 5 item
  3. 14-19 2 item