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  1. SOM-Q7-MX8M
    SOM-Q7-MX8M
    Qseven® Rel. 2.1 Computer on Module (CoM) with NXP i.MX 8M Applications Processors. (MIRA - C25)
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Cpu Power Consumption
  1. range 10-25 W 2 item
  2. range < 10 W 4 item
  3. range > 25 W 1 item
Cpu Type
  1. AMD® Ryzen™ embedded V-Series™ 1 item
  2. MediaTek Genio 510 1 item
  3. NXP i.MX 8M 1 item
  4. NXP i.MX8  1 item
  5. Qualcomm® QCS5430 1 item
  6. Qualcomm® QCS6490 1 item
  7. Rockchip RK3399 4 item
  8. Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 11 item
  2. ETHERNET≥2 6 item
Form Factor
  1. Boxed Solutions 1 item
  2. COM Express® 1 item
  3. Modular HMIs 1 item
  4. Qseven 2 item
  5. Single Board Computer  1 item
  6. SMARC 4 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 7 item
  2. ≤ 80 x 80mm 3 item
  3. ≥ 100 x 100mm 2 item
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Compact 1 item
  3. Qseven 70x70 mm 2 item
Mass Storage
  1. microSD card slot  2 item
  2. onboard eMMC 10 item
  3. SATA channels ≥ 1 2 item
  4. SATA channels ≥ 2  1 item
  5. SD interface  4 item
Memory
  1. soldered down 10 item
  2. SO_DIMM 1 item
  3. ≤1 10 item
  4. ≤2 9 item
  5. ≤4 9 item
  6. ≤8 4 item
  7. ≥32 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 item
  2. -20°C ÷ +70°C 3 item
  3. -40°C ÷ +85°C 4 item
  4. 0°C ÷ +50°C 9 item
  5. 0°C ÷ +60°C 8 item
  6. 20°C ÷ +70°C 7 item
Pci Express
  1. PCI-e lanes ≥ 1 5 item
  2. PCI-e lanes ≥ 2 4 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. ≥1 7 item
  2. ≥2 6 item
  3. ≥3 2 item
USB
  1. USB 2.0 ≥ 1  9 item
  2. USB 2.0 ≥ 2  9 item
  3. USB 2.0 ≥ 3 8 item
  4. USB 2.0 ≥ 4 6 item
  5. USB 2.0 ≥ 5 2 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 6 item
  8. USB 3.0 ≥ 2 4 item
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 3 item
  11. USB OTG 3 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 4 item
  2. ONBOARD WI-FI/BLE 3 item
Installation Depth
  1. >45 2 item
Screen Dimension
  1. 10-14 1 item
  2. 14-19 1 item