Architecture

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  1. Titan 300 TGL-UP3 AI
    Titan 300 TGL-UP3 AI
    Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 
  2. SOM-COM-HPC-A-TGL-UP3
    SOM-COM-HPC-A-TGL-UP3
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)

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