SOM-SMARC-TWL
Основные моменты
GraphicsIntegrated Intel® Graphics with up to 32 Execution Units, supporting 3 independent displays
MemoryQuad channel LPDDR5 soldered down with IBECC
Connectivity2 x NBase-T (2.5GbE supported); 6x Hi-Speed USB; 2xUSB 10Gbps; 4x PCI-e lanes Gen3 with optional SERDES
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Откройте для себя приложения, совместимые с этим продуктом, доступные в SECO Application Hub: готовые решения для ускорения разработки и развертывания интеллектуальных функций.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
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SMARC® Rel. 2.1 compliant module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08) |
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Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Twin Lake) Intel® Core™ i3-N355 Intel® Processor N250 Intel® Processor N150 |
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Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code) |
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Integrated Intel® Graphics Intel® Core™ i3-N355 Intel® Processor N250 Intel® Processor N150 |
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Display & Camera Interfaces eDP 1.3 or dual channel 18/24-bit LVDS interface (factory alternatives) 2x DP++ multimode DP 1.4 / HDMI® 2.1 interface 2x MIPI CSI-2 inputs (1 x 2-lanes and 1 x 4-lanes) |
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Up to 4096x2160 @60Hz |
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1x external S-ATA Gen3.2 channel Optional eMMC 5.1 drive soldered on-board |
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Networking 2x NBase-T Ethernet ports (2.5GbE supported) implemented using Intel® i225 Gigabit Ethernet controllers, Optional SERDES (SGMII) interface for an additional third Gigabit Ethernet |
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6x Hi-Speed USB interfaces 2x USB 10Gbps interfaces |
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4x PCIe lanes Gen3 Possible channel aggregations: • 4 ports x1 lanes (4x1) • 1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane |
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HD audio and Soundwire / i2S audio interfaces |
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2x UARTs 2x HS-UARTs |
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Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals Watchdog |
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+5VDC and +3VDC for RTC |
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Microsoft® Windows 10 LTSC, Windows 11 LTSC Linux Kernel LTS |
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0°C to +60°C (Commercial version) |
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50 x 82 mm |
Номер детали
SMARC 2.1 w/ Twin Lake Intel® N150, LPDDR5 4800 MT/s, 4 core, RAM 4GB Single Channel, eMMC 32GB, x1 Gigabit Ethernet, eDP + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q2.0, with SPI1 GP SPI
SMARC 2.1 w/ Twin Lake Intel® N250, LPDDR5 4800 MT/s, 4 core, RAM 8GB Single Channel, eMMC 64GB, x1 Gigabit Ethernet, LVDS + DP++ + DP++, w/ SERDES (PCIe: (1x2 + 1x1 or 3x1) + SERDES), TPM SLB 9670 Q2.0, with eSPI
SMARC 2.1 w/ Twin Lake Intel® Core i3-N355, LPDDR5 4800 MT/s, 8 core, RAM 16GB Dual Channel, eMMC 64GB, x2 Gigabit Ethernet, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670, with SPI1 GP SPI