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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. Ethernet
    ETHERNET≥2
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Cpu Maker
  1. AMD 2 items
  2. Intel 9 items
  3. NXP 5 items
  4. Qualcomm 4 items
Cpu Power Consumption
  1. range 10-25 W 5 items
  2. range < 10 W 3 items
  3. range < 5 W 1 item
  4. range > 25 W 1 item
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. Intel® Atom™ 4 items
  3. Intel® Celeron® 3 items
  4. Intel® Core™ 6 items
  5. Intel® Pentium® 2 items
  6. NXP i.MX 8M Plus 2 items
  7. NXP i.MX 8X 1 item
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX 95 1 item
  10. Qualcomm® QCS5430 1 item
  11. Qualcomm® QCS6490 1 item
  12. Zynq® Ultras 1 item
  13. Qualcomm Dragonwing IQ-X 1 item
  14. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 48 items
  2. ETHERNET≥2 20 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 4 items
  3. SMARC 13 items
  4. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 67,6 x 36,7 mm 1 item
  3. ≤ 100 x 100mm 11 items
  4. ≤ 80 x 80mm 7 items
  5. ≥ 100 x 100mm 1 item
  6. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM-HPC Client 3 items
Memory
  1. memory ≤1 12 items
  2. memory ≤16 6 items
  3. memory ≤2 13 items
  4. memory ≤4 12 items
  5. memory ≤8 10 items
  6. memory ≥32 4 items
  7. soldered down 12 items
  8. SO_DIMM 5 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. M.2 NVMe SSD slot 3 items
  3. M.2 SATA SSD slot 1 item
  4. onboard eMMC 10 items
  5. onboard eMMC 3 items
  6. SATA channels ≥ 1 8 items
  7. SATA channels ≥ 2 3 items
  8. SATA channels ≥ 2 1 item
  9. SD interface 5 items
  10. SD interface 4 items
  11. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 9 items
  2. -40°C ÷ +85°C 14 items
  3. 0°C ÷ +50°C 10 items
  4. 0°C ÷ +60°C 17 items
  5. 20°C ÷ +70°C 8 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 12 items
  2. PCI-e lanes ≥ 2 10 items
  3. PCI-e lanes ≥ 3 6 items
  4. PCI-e lanes ≥ 4 9 items
  5. PCI-e lanes ≥ 5 4 items
Ttl Uarts
  1. TTL Uarts ≥1 12 items
  2. TTL Uarts ≥2 14 items
  3. TTL Uarts ≥3 7 items
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 10 items
  4. USB 2.0 ≥ 4 10 items
  5. USB 2.0 ≥ 5 6 items
  6. USB 2.0 ≥ 6 7 items
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 6 items
  9. USB 3.1 ≥ 1 5 items
  10. USB 3.1 ≥ 2 3 items
  11. USB 3.2 ≥ 1 3 items
  12. USB 3.2 ≥ 2 4 items
  13. USB 4.0 ≥ 1 1 item
  14. USB 4.0 ≥ 2 1 item
  15. USB 4.0 ≥ 3 1 item
  16. USB 4.0 ≥ 4 2 items
  17. USB OTG 5 items
Video Interfaces
  1. DDI 3 items
  2. DP 6 items
  3. DP++ 7 items
  4. DUAL CHANNEL LVDS 9 items
  5. eDP 12 items
  6. HDMI 10 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 8 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 7 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 4 items
  3. /s/n/snapdragon-x_per_sito.jpg 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®