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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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Покупаем сейчас по
  1. Ethernet
    ETHERNET≥2
  2. USB
    USB 3.1 ≥ 1
  3. Video Interfaces
    DP
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Cpu Maker
  1. Intel 1 item
  2. Qualcomm 2 items
Cpu Type
  1. Intel® Core™ 1 item
  2. Qualcomm® QCS5430 1 item
  3. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM-HPC® 1 item
  2. SMARC 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤16 1 item
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 3 items
  6. memory ≥32 1 item
  7. soldered down 2 items
  8. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. onboard eMMC 2 items
  3. SATA channels ≥ 1 1 item
  4. SATA channels ≥ 2 1 item
  5. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. 0°C ÷ +50°C 3 items
  3. 0°C ÷ +60°C 3 items
  4. 20°C ÷ +70°C 2 items
  5. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 3 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 5 items
  3. USB 2.0 ≥ 3 5 items
  4. USB 2.0 ≥ 4 4 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 2 items
  9. USB 3.1 ≥ 1 3 items
  10. USB 3.1 ≥ 2 1 item
  11. USB 3.2 ≥ 1 2 items
  12. USB 3.2 ≥ 2 2 items
  13. USB OTG 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 3 items
  5. eDP 4 items
  6. HDMI 2 items
  7. MIPI-CSI camera conn 1 item
  8. MIPI-DSI 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®