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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
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  1. Ethernet
    ETHERNET≥1
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Cpu Maker
  1. AMD 6 items
  2. Intel 23 items
  3. MediaTek 2 items
  4. NXP 13 items
  5. Qualcomm 3 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 15 items
  2. range < 10 W 16 items
  3. range < 5 W 6 items
  4. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 2 items
  4. Intel® Atom™ 13 items
  5. Intel® Celeron® 13 items
  6. Intel® Core™ 12 items
  7. Intel® Pentium® 6 items
  8. Intel® Xeon® 2 items
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 8M 3 items
  12. NXP i.MX 8M Mini 3 items
  13. NXP i.MX 8M Nano 2 items
  14. NXP i.MX 8M Plus 1 item
  15. NXP i.MX 933/935 1 item
  16. NXP i.MX 95 1 item
  17. NXP i.MX6 3 items
  18. NXP i.MX8 1 item
  19. Qualcomm Snapdragon 1 item
  20. Qualcomm® QCS5430 1 item
  21. Qualcomm® QCS6490 1 item
  22. Rockchip RK3588 1 item
  23. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 48 items
  2. ETHERNET≥2 20 items
Form Factor
  1. COM Express® 19 items
  2. COM-HPC® 2 items
  3. Myon MicroModule SOM 2 items
  4. Qseven 10 items
  5. SMARC 11 items
  6. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 4 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 items
  3. 48,5 x 32,5 mm 2 items
  4. 67,6 x 36,7 mm 4 items
  5. ≤ 100 x 100mm 29 items
  6. ≤ 80 x 80mm 14 items
  7. ≥ 100 x 100mm 3 items
  8. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 7 items
  2. COM Express Compact 12 items
  3. COM-HPC Client 2 items
  4. Qseven 70x70 mm 7 items
  5. µQseven 70x40 3 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 39 items
  2. memory ≤16 16 items
  3. memory ≤2 40 items
  4. memory ≤4 37 items
  5. memory ≤8 31 items
  6. memory ≥32 15 items
  7. soldered down 20 items
  8. SO_DIMM 16 items
Mass Storage
  1. onboard SSD 2 items
  2. M.2 NVMe SSD slot 3 items
  3. M.2 SATA SSD slot 2 items
  4. microSD card slot 5 items
  5. onboard eMMC 30 items
  6. onboard eMMC 4 items
  7. SATA channels ≥ 1 26 items
  8. SATA channels ≥ 2 20 items
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 2 3 items
  11. SATA channels ≥ 3 2 items
  12. SATA channels ≥ 4 1 item
  13. SD interface 15 items
  14. SD interface 3 items
Operating Temperature
  1. -20°C ÷ +60°C 26 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 35 items
  4. 0°C ÷ +50°C 30 items
  5. 0°C ÷ +60°C 39 items
  6. 20°C ÷ +70°C 24 items
  7. -20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 34 items
  2. PCI-e lanes ≥ 2 29 items
  3. PCI-e lanes ≥ 3 24 items
  4. PCI-e lanes ≥ 4 23 items
  5. PCI-e lanes ≥ 5 17 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 38 items
  2. TTL Uarts ≥2 37 items
  3. TTL Uarts ≥3 12 items
USB
  1. USB 2.0 ≥ 1 37 items
  2. USB 2.0 ≥ 2 35 items
  3. USB 2.0 ≥ 3 32 items
  4. USB 2.0 ≥ 4 32 items
  5. USB 2.0 ≥ 5 25 items
  6. USB 2.0 ≥ 6 25 items
  7. USB 3.0 ≥ 1 20 items
  8. USB 3.0 ≥ 2 15 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 11 items
  12. USB 3.1 ≥ 2 7 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 6 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 4 items
  17. USB CLIENT 1 item
  18. USB OTG 13 items
Video Interfaces
  1. DDI 17 items
  2. DP 24 items
  3. DP++ 8 items
  4. DUAL CHANNEL LVDS 33 items
  5. eDP 31 items
  6. HDMI 31 items
  7. MIPI-CSI camera conn 9 items
  8. MIPI-DSI 10 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 30 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. ONBOARD WI-FI/BLE 5 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®