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COM-HPC®
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SMARC®
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Покупаем сейчас по
  1. Ethernet
    ETHERNET≥1
  2. Operating Temperature
    -40°C ÷ +85°C
  3. Video Interfaces
    eDP
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Cpu Maker
  1. AMD 3 items
  2. Intel 12 items
  3. MediaTek 1 item
  4. NXP 1 item
  5. Qualcomm 1 item
  6. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 6 items
  3. range > 25 W 5 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 9 items
  4. Intel® Celeron® 7 items
  5. Intel® Core™ 5 items
  6. Intel® Pentium® 6 items
  7. Intel® Xeon® 1 item
  8. MediaTek Genio 510 1 item
  9. NXP i.MX 8M 1 item
  10. Rockchip RK3588 1 item
  11. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 19 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 11 items
  2. COM-HPC® 1 item
  3. Qseven 3 items
  4. SMARC 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 13 items
  3. ≤ 80 x 80mm 5 items
  4. ≥ 100 x 100mm 1 item
  5. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM Express Compact 9 items
  3. COM-HPC Client 1 item
  4. Qseven 70x70 mm 3 items
Memory
  1. memory ≤1 14 items
  2. memory ≤16 9 items
  3. memory ≤2 13 items
  4. memory ≤4 14 items
  5. memory ≤8 13 items
  6. memory ≥32 6 items
  7. soldered down 8 items
  8. SO_DIMM 9 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 1 item
  3. microSD card slot 3 items
  4. onboard eMMC 12 items
  5. onboard eMMC 1 item
  6. SATA channels ≥ 1 12 items
  7. SATA channels ≥ 1 1 item
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 2 9 items
  10. SD interface 3 items
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 14 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 19 items
  4. 0°C ÷ +50°C 18 items
  5. 0°C ÷ +60°C 27 items
  6. 20°C ÷ +70°C 15 items
  7. -20°C ÷ +70°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 14 items
  2. PCI-e lanes ≥ 2 13 items
  3. PCI-e lanes ≥ 3 13 items
  4. PCI-e lanes ≥ 4 15 items
  5. PCI-e lanes ≥ 5 9 items
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 17 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 15 items
  2. USB 2.0 ≥ 2 14 items
  3. USB 2.0 ≥ 3 14 items
  4. USB 2.0 ≥ 4 14 items
  5. USB 2.0 ≥ 5 14 items
  6. USB 2.0 ≥ 6 16 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 3 6 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 4 items
  13. USB 3.2 ≥ 1 3 items
  14. USB 3.2 ≥ 2 5 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 2 items
  17. USB CLIENT 1 item
  18. USB OTG 1 item
Video Interfaces
  1. DDI 9 items
  2. DP 15 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 22 items
  5. eDP 19 items
  6. HDMI 21 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 7 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 22 items
  11. VGA 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®