Menu
Account
Модули
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Модули

Shop By
Clear All

Items 1-6 of 11

Set Descending Direction
Page
per page
Shop By
Покупаем сейчас по
  1. Ethernet
    ETHERNET≥1
  2. Memory
    soldered down
  3. Video Interfaces
    SINGLE CHANNEL LVDS
Clear All
Shopping Options
Cpu Maker
  1. AMD 1 item
  2. Intel 2 items
  3. NXP 7 items
  4. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 3 items
  2. range < 10 W 9 items
Cpu Type
  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 2 items
  3. Intel® Pentium® 2 items
  4. NXP i.MX 8M 2 items
  5. NXP i.MX 8M Mini 1 item
  6. NXP i.MX 8M Nano 1 item
  7. NXP i.MX 933/935 1 item
  8. NXP i.MX6 2 items
  9. NXP i.MX8 1 item
  10. Zynq® Ultras 1 item
  11. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 11 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 6 items
  3. SMARC 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 8 items
  4. ≤ 80 x 80mm 9 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
  2. Qseven 70x70 mm 4 items
  3. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 21 items
  2. memory ≤16 9 items
  3. memory ≤2 22 items
  4. memory ≤4 21 items
  5. memory ≤8 16 items
  6. memory ≥32 9 items
  7. soldered down 11 items
  8. SO_DIMM 13 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. microSD card slot 2 items
  4. onboard eMMC 10 items
  5. SATA channels ≥ 1 5 items
  6. SATA channels ≥ 2 1 item
  7. SD interface 9 items
  8. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 8 items
  2. -40°C ÷ +85°C 10 items
  3. 0°C ÷ +50°C 9 items
  4. 0°C ÷ +60°C 11 items
  5. 20°C ÷ +70°C 9 items
Pci Express
  1. PCI-e lanes ≥ 1 9 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 3 items
  4. PCI-e lanes ≥ 4 3 items
  5. PCI-e lanes ≥ 5 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 9 items
  2. TTL Uarts ≥2 8 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 9 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 8 items
  4. USB 2.0 ≥ 4 8 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 6 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.0 ≥ 4 1 item
  10. USB OTG 7 items
Video Interfaces
  1. DP 8 items
  2. DP++ 5 items
  3. DUAL CHANNEL LVDS 15 items
  4. eDP 11 items
  5. HDMI 10 items
  6. MIPI-CSI camera conn 6 items
  7. MIPI-DSI 5 items
  8. SINGLE CHANNEL LVDS 11 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 4 items
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®