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Модули
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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Покупаем сейчас по
  1. Cpu Maker
    Qualcomm
  2. Memory
    memory ≤1
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Cpu Maker
  1. AMD 4 items
  2. Intel 15 items
  3. MediaTek 2 items
  4. NXP 15 items
  5. Qualcomm 3 items
Cpu Power Consumption
  1. range < 5 W 1 item
Cpu Type
  1. Qualcomm Snapdragon 1 item
  2. Qualcomm® QCS5430 1 item
  3. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 2 items
Form Factor
  1. Myon MicroModule SOM 1 item
  2. SMARC 2 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. ≤ 100 x 100mm 2 items
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. soldered down 4 items
  6. memory ≤32 1 item
  7. UFS 3.1 module on-board 1 item
  8. I2C EEPROM 2 items
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. onboard eMMC 2 items
  3. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. 0°C ÷ +50°C 2 items
  3. 0°C ÷ +60°C 2 items
  4. 20°C ÷ +70°C 2 items
  5. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 3.1 ≥ 1 2 items
  6. USB OTG 1 item
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 2 items
  4. MIPI-CSI camera conn 1 item
  5. MIPI-DSI 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®