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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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Покупаем сейчас по
  1. Cpu Maker
    NXP
  2. USB
    USB 2.0 ≥ 3
  3. Video Interfaces
    MIPI-CSI camera conn
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Shopping Options
Cpu Maker
  1. Intel 3 items
  2. NXP 2 items
  3. Qualcomm 1 item
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. NXP i.MX6 1 item
  2. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Qseven 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. Qseven 70x70 mm 1 item
  2. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 1 item
  6. soldered down 1 item
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 1 item
  3. onboard eMMC 1 item
  4. onboard eMMC 1 item
  5. SATA channels ≥ 1 1 item
  6. SD interface 1 item
  7. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB OTG 3 items
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 6 items
  3. eDP 3 items
  4. HDMI 6 items
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 1 item
  7. SINGLE CHANNEL LVDS 7 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®