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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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  1. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. MediaTek 3 items
  4. NXP 18 items
  5. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 10 items
  3. range < 5 W 5 items
Cpu Type
  1. MediaTek Genio 510 1 item
  2. MediaTek Genio 700 1 item
  3. NXP i.MX 8M 4 items
  4. NXP i.MX 8M Mini 4 items
  5. NXP i.MX 8M Nano 2 items
  6. NXP i.MX 8M Plus 2 items
  7. NXP i.MX 8X 2 items
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX 95 1 item
  10. NXP i.MX6 3 items
  11. NXP i.MX8 2 items
  12. Zynq® Ultras 1 item
  13. Qualcomm Dragonwing IQ-X 1 item
  14. MediaTek Genio360 1 item
  15. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 21 items
  2. ETHERNET≥2 12 items
Form Factor
  1. COM Express® 1 item
  2. Myon MicroModule SOM 1 item
  3. Qseven 4 items
  4. SMARC 9 items
  5. Trizeps SODIMM SOM 5 items
  6. Single Board Computer 5 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 48,5 x 32,5 mm 1 item
  3. 67,6 x 36,7 mm 5 items
  4. ≤ 100 x 100mm 11 items
  5. ≤ 80 x 80mm 8 items
  6. ≥ 100 x 100mm 4 items
  7. COM Express® 1 item
Form Factor Specification
  1. 3,5" 4 items
  2. Other SBCs 1 item
  3. Qseven 70x70 mm 3 items
  4. µQseven 70x40 1 item
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 22 items
  2. memory ≤16 1 item
  3. memory ≤2 23 items
  4. memory ≤4 19 items
  5. memory ≤8 10 items
  6. soldered down 16 items
  7. memory ≤32 1 item
  8. I2C EEPROM 1 item
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 1 item
  2. I2C EEPROM 1 item
  3. microSD card slot 5 items
  4. onboard eMMC 1 item
  5. onboard eMMC 19 items
  6. onboard eMMC 3 items
  7. SATA channels ≥ 1 3 items
  8. SD interface 8 items
  9. SD interface 3 items
  10. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 19 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 25 items
  4. 0°C ÷ +50°C 28 items
  5. 0°C ÷ +60°C 36 items
  6. 20°C ÷ +70°C 16 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 12 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 20 items
  2. TTL Uarts ≥2 18 items
  3. TTL Uarts ≥3 17 items
USB
  1. USB 2.0 ≥ 1 19 items
  2. USB 2.0 ≥ 2 17 items
  3. USB 2.0 ≥ 3 12 items
  4. USB 2.0 ≥ 4 10 items
  5. USB 2.0 ≥ 5 6 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 12 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.1 ≥ 1 2 items
  10. USB OTG 15 items
Video Interfaces
  1. DP 5 items
  2. DUAL CHANNEL LVDS 16 items
  3. eDP 6 items
  4. HDMI 12 items
  5. MIPI-CSI camera conn 4 items
  6. MIPI-DSI 9 items
  7. PARALLEL RGB 4 items
  8. SINGLE CHANNEL LVDS 18 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 3 items
  3. ONBOARD WI-FI/BLE 10 items
  4. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
  5. /s/n/snapdragon-x_per_sito.jpg 1 item