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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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  1. Memory
    memory ≤8
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Cpu Maker
  1. NXP 4 items
  2. Qualcomm 2 items
Cpu Power Consumption
  1. range < 5 W 4 items
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8M Mini 2 items
  3. NXP i.MX 8M Nano 1 item
  4. NXP i.MX 8M Plus 1 item
  5. Qualcomm® QCS5430 1 item
  6. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 6 items
  2. ETHERNET≥2 3 items
Form Factor
  1. Myon MicroModule SOM 1 item
  2. SMARC 2 items
  3. Trizeps SODIMM SOM 3 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. 67,6 x 36,7 mm 3 items
  3. ≤ 100 x 100mm 2 items
Memory
  1. memory ≤1 9 items
  2. memory ≤2 10 items
  3. memory ≤4 9 items
  4. memory ≤8 6 items
  5. soldered down 6 items
  6. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 4 items
  2. onboard eMMC 2 items
  3. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 2 items
Ttl Uarts
  1. TTL Uarts ≥1 6 items
  2. TTL Uarts ≥2 6 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 4 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 3.0 ≥ 1 2 items
  6. USB 3.0 ≥ 2 2 items
  7. USB 3.1 ≥ 1 2 items
  8. USB OTG 1 item
Video Interfaces
  1. DP 4 items
  2. DUAL CHANNEL LVDS 8 items
  3. eDP 4 items
  4. HDMI 4 items
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 6 items
  7. PARALLEL RGB 3 items
  8. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items