
Наша продукция
Shop By
-
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)x86 Модули COM-HPC® Intel Processor -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Модули COM-HPC® Intel Processor Аппаратное обеспечение AI -
SBC-3.5-RK35683.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)Arm Rockchip Processor SBC 3.5-inch SBC -
Carrier-Trizeps-pConXSCarrier Board for Trizeps SODIMM SOMsНаборы разработки и аксессуары Несущая плата Trizeps Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards Trizeps Carrier Boards -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® AMD Processor -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Intel Processor