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SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)x86 Модули COM-HPC® Intel Processor -
SBC-eNUC-APLembedded NUC™ SBC with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ALVIN - B68)x86 Intel Processor SBC Embedded NUC™ -
SBC-3.5-RV10003.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)SBC 3.5-inch SBC -
SBC-3.5-MX8X3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)Arm NXP Processor SBC 3.5-inch SBC -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedНаборы разработки и аксессуары Аксессуары Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® AMD Processor