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SOM-COM-HPC-A-Dragonwing-IQ10COM-HPC® 1.3 Client Size A module based on Qualcomm Dragonwing™ IQ10 Series, with up to 700 TOPS of AI Acceleration.Модули COM-HPC® Процессор Qualcomm Processor Стандарт COM-HPC® -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U). (E87)x86 Модули COM-HPC® Intel Processor -
UDOO BOLT GEARBoxed solution based on AMD Embedded Ryzen V1605B Applications Processorx86 AMD Processor SBC Development Kits & Accessories -
UDOO BOLTSBC based on AMD Embedded Ryzen V1000B family of Applications ProcessorAMD Processor SBC Другие форм-факторы Development Kits & Accessories -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel Processor Безвентиляторные встраиваемые компьютеры -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)x86 Модули COM-HPC® Intel Processor