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Cpu Maker
  1. AMD 2 items
  2. Intel 20 items
Cpu Power Consumption
  1. range 10-25 W 3 items
  2. range < 10 W 5 items
Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. Espressif ESP32-D0WD 1 item
  3. Intel® Atom™ 11 items
  4. Intel® Celeron® 8 items
  5. Intel® Core™ 7 items
  6. Intel® Pentium® 7 items
Ethernet
  1. ETHERNET≥1 14 items
  2. ETHERNET≥2 18 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 2 items
  3. Single Board Compute 2 items
  4. SMARC 2 items
  5. Boxed Solutions 6 items
  6. Single Board Computer 2 items
  7. Single Board Computer 8 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 6 items
  3. ≤ 80 x 80mm 1 item
  4. ≥ 100 x 100mm 6 items
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 2 items
  3. COM-HPC Client 2 items
  4. embedded NUC 1 item
  5. Other SBCs 4 items
  6. Pico-ITX 5 items
Memory
  1. memory ≤1 8 items
  2. memory ≤16 8 items
  3. memory ≤2 9 items
  4. memory ≤4 8 items
  5. memory ≤8 11 items
  6. memory ≥32 6 items
  7. soldered down 10 items
  8. SO_DIMM 7 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 4 items
  3. standard SATA connector 9 items
  4. soldered down 1 item
  5. CFAST slot 2 items
  6. I2C EEPROM 1 item
  7. M.2 NVMe SSD slot 11 items
  8. M.2 SATA SSD slot 25 items
  9. microSD card slot 33 items
  10. onboard eMMC 5 items
  11. onboard eMMC 50 items
  12. onboard eMMC 31 items
  13. SATA channels ≥ 1 39 items
  14. SATA channels ≥ 1 3 items
  15. SATA channels ≥ 2 1 item
  16. SATA channels ≥ 2 8 items
  17. SATA channels ≥ 2 22 items
  18. SATA channels ≥ 3 7 items
  19. SATA channels ≥ 4 5 items
  20. SD interface 17 items
  21. SD interface 22 items
  22. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  23. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 5 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 8 items
  4. 0°C ÷ +50°C 9 items
  5. 0°C ÷ +60°C 19 items
  6. 20°C ÷ +70°C 5 items
  7. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 4 items
Ttl Uarts
  1. TTL Uarts ≥2 7 items
USB
  1. USB 2.0 ≥ 1 6 items
  2. USB 2.0 ≥ 2 5 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 6 items
  7. USB 3.0 ≥ 2 7 items
  8. USB 3.0 ≥ 3 3 items
  9. USB 3.1 ≥ 1 1 item
  10. USB 3.1 ≥ 2 1 item
  11. USB 3.2 ≥ 1 3 items
  12. USB 3.2 ≥ 2 5 items
  13. USB 4.0 ≥ 2 2 items
  14. USB 4.0 ≥ 4 1 item
  15. USB OTG 7 items
Video Interfaces
  1. DDI 3 items
  2. DP 9 items
  3. DP++ 13 items
  4. DUAL CHANNEL LVDS 7 items
  5. eDP 9 items
  6. HDMI 15 items
  7. MIPI-CSI camera conn 3 items
  8. MIPI-DSI 1 item
  9. SINGLE CHANNEL LVDS 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 12 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 8 items
  4. ONBOARD WI-FI/BLE 3 items
Наша продукция
  • Модули
  • SBC
  • Решения HMI
  • Безвентиляторные встраиваемые компьютеры
  • Встроенные компьютеры
  • Платежные системы
  • Наборы разработки и аксессуары
  • Аппаратное обеспечение AI
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution