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Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel Processor Безвентиляторные встраиваемые компьютеры -
SOM-SMARC-MX8XSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors. (SWAN - D16)Arm Модули SMARC® NXP Processor -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Модули COM-HPC® Intel Processor Аппаратное обеспечение AI -
SBC-3.5-MX8X3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)Arm NXP Processor SBC 3.5-inch SBC -
SBC-3.5-MX8M-Mini3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61)Arm NXP Processor SBC 3.5-inch SBC -
SBC-3.5-MX83.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)Arm NXP Processor 3.5-inch SBC