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  1. Memory
    SO_DIMM
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Cpu Maker
  1. AMD 10 items
  2. Intel 20 items
Cpu Power Consumption
  1. range 10-25 W 12 items
  2. range < 10 W 2 items
  3. range > 25 W 10 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 4 items
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series 1 item
  5. AMD® Ryzen™ embedded 5 items
  6. Espressif ESP32-D0WD 1 item
  7. Intel® Atom™ 4 items
  8. Intel® Celeron® 8 items
  9. Intel® Core™ 18 items
  10. Intel® Pentium® 3 items
  11. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 23 items
  2. ETHERNET≥2 13 items
Form Factor
  1. COM Express® 15 items
  2. COM-HPC® 4 items
  3. Single Board Compute 1 item
  4. Boxed Solutions 7 items
  5. Single Board Computer 1 item
  6. Single Board Computer 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 9 items
  3. ≥ 100 x 100mm 9 items
  4. COM Express® 2 items
Form Factor Specification
  1. 3,5" 2 items
  2. COM Express Basic 5 items
  3. COM Express Compact 10 items
  4. COM-HPC Client 3 items
  5. Other SBCs 2 items
  6. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 80 items
  2. memory ≤16 31 items
  3. memory ≤2 73 items
  4. memory ≤4 63 items
  5. memory ≤8 52 items
  6. memory ≥32 26 items
  7. soldered down 53 items
  8. SO_DIMM 30 items
  9. memory ≤32 1 item
  10. UFS 3.1 module on-board 1 item
  11. I2C EEPROM 2 items
  12. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. standard SATA connector 1 item
  2. CFAST slot 2 items
  3. M.2 NVMe SSD slot 11 items
  4. M.2 SATA SSD slot 7 items
  5. microSD card slot 4 items
  6. onboard eMMC 6 items
  7. SATA channels ≥ 1 20 items
  8. SATA channels ≥ 1 1 item
  9. SATA channels ≥ 2 4 items
  10. SATA channels ≥ 2 18 items
  11. SATA channels ≥ 3 6 items
  12. SATA channels ≥ 4 4 items
  13. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 12 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 15 items
  4. 0°C ÷ +50°C 18 items
  5. 0°C ÷ +60°C 26 items
  6. 20°C ÷ +70°C 12 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 18 items
  2. PCI-e lanes ≥ 2 18 items
  3. PCI-e lanes ≥ 3 15 items
  4. PCI-e lanes ≥ 4 16 items
  5. PCI-e lanes ≥ 5 18 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 20 items
USB
  1. USB 2.0 ≥ 1 16 items
  2. USB 2.0 ≥ 2 16 items
  3. USB 2.0 ≥ 3 15 items
  4. USB 2.0 ≥ 4 15 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 14 items
  7. USB 3.0 ≥ 1 12 items
  8. USB 3.0 ≥ 2 13 items
  9. USB 3.0 ≥ 3 11 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 7 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 7 items
  14. USB 3.2 ≥ 2 8 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 2 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 1 item
  20. USB OTG 2 items
Video Interfaces
  1. DDI 16 items
  2. DP 19 items
  3. DP++ 8 items
  4. DUAL CHANNEL LVDS 14 items
  5. eDP 20 items
  6. HDMI 20 items
  7. MIPI-CSI camera conn 1 item
  8. MIPI-DSI 1 item
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 15 items
  11. VGA 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 9 items
  2. M.2 SOCKET 2 KEY 4 items
  3. M.2 Socket 2 key B 2 items
  4. ONBOARD WI-FI/BLE 2 items
製品一覧
  • Computer on Module
  • Single Board Computer
  • ヒューマンマシンインターフェース（HMI）
  • ファンレス組込みPC
  • Industrial Embedded PCs
  • 決済システム
  • 開発キットとアクセサリ
  • AI最適化ハードウェア
  • Modular Vision
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solutions