CETUS

AMD組込み型第3世代RシリーズSOC（旧称Merlin Falcon）またはGシリーズSOC-I（旧称Brown Falcon）またはGシリーズSOC-J（旧称Prairie Falcon）を搭載したファンレス組込みコンピュータ

データシート

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お問い合わせ

CPU

AMD Embedded™ 3rd generation R-Series SOC or G-Series SOC-I or G-Series SOC-J (formerly Prairie Falcon)

グラフィック

AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)

接続性

2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232

メモリ

Up to 2x 8GB DDR4 SODIMM modules

製品詳細

技術情報

商品説明	CETUS is a Fanless Embedded Computer based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon) designed for high level graphic performance. It includes 3 independent heads with UltraHD 4K resolution and h.264/h.265 4K hardware decoding and is ideal for digital signage and infotainment applications.
Cpu	AMD Embedded™ 3rd generation R-Series SOC (Merlin Falcon): AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W AMD Embedded™ 3rd generation G-Series SOC-I (Brown Falcon): AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon): AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W
メモリ	Up to 2x 8GB DDR4 SODIMM modules
グラフィック	AMD Radeon™ 3rd -Generation Graphics Core Next (GCN) RX-421BD -Radeon™ R7 RX-418GD -Radeon™ R6 RX-216GD -Radeon™ R5 GX-217GI -Radeon™ R6E GX-224IJ, Radeon™ R4E Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) Video Coding Engine (VCE) 3.1 (4K H.264 encode)
ビデオインターフェース	Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0
動画解像度	Up to 4K
大容量記憶装置	Up to 2x internal SATA drives 2x CFAST Slots 1x microSD card slot PCI-e x4 M.2 Key M NVMe SSD Slot
ネットワーク	2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers
USB	2x USB 3.0 Type-A sockets 2x USB 2.0 Type-A sockets 2x USB 3.0 on internal pin header 2x USB 2.0 on internal pin header
PCI	1 x PCI-e x4 port on M.2 Key M SSD Slot
オーディオ	5.1 non-amplified Jacks S/PDIF Amplified Audio Stereo + Sub 3x30W
シリアルポート	4 x RS-232 Full Modem ports on external DB9 male connectors 2 x RS-232 Full modem ports on internal IDC pin headers
その他のインターフェース	2x FAN connectors Optional TPM 1.2 TPM 2.0 embedded in SoC (Windows support only) 8 x GPI, 8 x GPO
電源装置	+12VDC ± 5%, mini-Fit 4x2 Power connector 220mAh non-rechargeable Coin cell battery for RTC
OS	Microsoft® Windows 10 Microsoft® Windows 10 IoT Linux
動作温度	0°C ÷ +60 °C (Commercial temp.) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
寸法	300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

ソフトウェア

BIOS	[BIOS] – Release version 1.08
Tools and Documents	[Tools and Documents] - Flash Tools
Windows 10	[Driver package] – Release version 01
Linux Kernel Patches	[Amdgpu kernel package] - Kernel package 4.14 for Ubuntu 18.04.1 [Amdgpu kernel package] - Kernel package 4.9 for Ubuntu 18.04.1