SOM-SMARC-MX8M

Computer on Module (CoM) SMARC® Rel. 2.1.1 con processore NXP i.MX 8M. (LEXELL - C12)

Disponibile nell'intervallo di temperatura industriale

Data sheet

Wiki

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Cpu

NXP i.MX 8M Applications Processors

Grafica

Integrated Graphics Processing Unit, supports 2 independent displays

Connettività

WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os

Memoria

Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface.

Dettagli Prodotto

Informazioni tecniche

Descrizione	Computer on Module (CoM) SMARC® Rel. 2.1.1 con processore NXP i.MX 8M
Cpu	NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor: • i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz • i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz • i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Memoria	Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
Grafica	Integrated Graphics Processing Unit, supports 2 independent displays Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
Interfacce video	HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4 18- / 24-bit Dual Channel LVDS interface (factory option)
Risoluzione video	HDMI Up to 4096 x 2160 @ 60 (4K) LVDS Up to 1920 x 1080 @ 60Hz
Memoria di massa	Optional SD 4-bit interface QSPI Flash soldered-onboard eMMC 5.0 drive soldered on-board
Rete	1 x Gigabit Ethernet interface Optional WiFi + BT LE module onboard
USB	2 USB 3.0 Host ports 2 USB 2.0 Host ports 1 USB 2.0 OTG port
Pci	2x PCI-e x1 ports
Audio	I2S Audio Interface
Porte seriali	Up to 2x UART Tx/Rx/RTS/CTS 2x UART Tx/Rx 1x CAN Bus (TTL level)
Altre interfacce	1x 4-lanes + 1x 2-lanes CSI camera interfaces I2C Bus SM Bus 2x SPI interfaces QuadSPI interface 14 x GPI/Os Boot select signals Power Management Signals
Dispositivo di alimentazione	+5VDC +3.3V_RTC
Sistema operativo	Linux Yocto Android
Temperatura operativa	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensioni	50 x 82 mm (1.97” x 3.23”)

Software

Link	SECO Technical Resources

Documentazione

Data Sheet	[Datasheet] SOM-SMARC-MX8M Rel 1.5
Manual	[Manual] SOM-SMARC-MX8M Rel 1.4
Image	[Picture] LEXELL_back [Picture] LEXELL_front

Part Number

Elementi prodotti raggruppati
RC12-3320-2112-C2-V	Descrizione Part Number SM-C12 i.MX8M Quad Lite1.5 GHz (GPU, No VPU), LPDDR4 4 GB, eMMC 8 GB, LVDS + HDMI, uSD + UART4 , PCIe, NO CAN/ NO RTC, Comm. Temp.	Contattaci
RC12-5520-2111-I2-V	Descrizione Part Number SM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 8 GB, LVDS + HDMI, uSD + UART4, PCIe, CAN, Ind. Temp	Contattaci
RC12-5630-2111-I2-V	Descrizione Part Number SM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 4 GB, eMMC 16 GB, LVDS + HDMI, uSD + UART4, PCIe, CAN, Ind. Temp	Contattaci