SOM-SMARC-MX8M-Plus

Computer on Module (CoM) SMARC® Rel. 2.1.1 con processori NXP i.MX 8M Plus. (LEVY - D18)

Disponibile nell'intervallo di temperatura industriale

Data sheet

Wiki

Contattaci per maggiori informazioni e per preventivi

Contattaci

Cpu

NXP i.MX 8M Plus Applications Processors

Grafica

Integrated GPU, supports 3 independent displays

Connettività

2x Gigabit Ethernet; opt. Wi-Fi +BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB2.0; 1x PCI-e x1; 2x CAN Bus; 4xUART; 14x GPI/Os; QuadSPI interface

Memoria

up to 6GB soldered down LPDDR4-4000 memory

Dettagli Prodotto

Informazioni tecniche

Descrizione	Computer on Module (CoM) SMARC® Rel. 2.1.1 con processori NXP i.MX 8M Plus
Cpu	NXP i.MX 8M Plus family SoCs: Dual or Quad ARM Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor • NXP i.MX 8M Plus Quad, 4x ARM Cortex®-A53 Cores up to 1.8GHz • NXP i.MX 8M Plus Dual, 2x ARM Cortex®-A53 Cores up to 1.8GHz • NXP i.MX 8M Plus Quad Lite, 4x ARM Cortex®-A53 Cores up to 1.8GHz, no VPU / NPU NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)
Numero Max Core	4+1
Memoria	Soldered down LPDDR4-4000 memory, 32-bit interface, up to 6GB
Grafica	Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays. Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264 Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan
Interfacce video	Up to 3 video display interfaces HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4/1.3 2xLVDS Single Channel / 1xLVDS Dual Channel or eDP + 1xLVDS Single Channel (factory alternatives)
Risoluzione video	HDMI: Up to 3840 x 2160 @30 LVDS/eDP: Up to 1920 x 1080 @60
Memoria di massa	Soldered onboard eMMC 5.1 Drive, up to 64GB SD 4-bit interface
Rete	Up to 2 x Gigabit Ethernet interfaces Optional WiFi + BT LE module onboard
USB	2 x USB 2.0 Host Ports 2 x USB 3.0 Host Ports 1 x USB 2.0 Host/Client port
Pci	Up to 1x PCI-e x1 Gen3 port
Audio	Up to 2x I2S Audio interfaces
Porte seriali	2x 2-wires UART 2x 4-wires UART
Altre interfacce	1x 4-lanes CSI camera interface 1x 2-lanes CSI camera interface 2x PWM Up to 14x GPIOs I2C bus SM bus SPI interface QuadSPI interface Watchdog Boot select signals Power Management Signals
Dispositivo di alimentazione	+5VDC ± 5% and +3.3V_RTC
Sistema operativo	Linux
Temperatura operativa	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version, without WiF+BT optional module) Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
Dimensioni	50 x 82 mm (1.97” x 3.23”)

Software

Link	SECO Technical Resources

Documentazione

Data Sheet	[Datasheet] SOM-SMARC-MX8M-Plus Rel 1.7
Manual	[Manual] SOM-SMARC-MX8M-Plus Rel 1.3
Image	[Picture] SOM-SMARC-MX8M-Plus_front [Picture] SOM-SMARC-MX8M-Plus_back