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SOM-COMe-CT6-Snapdragon-X
COM Express 3.1 Type 6 Compact modules with Qualcomm Snapdragon X / X Plus
/ X Elite line of processors in SiP-A, with Qualcomm Hexagon NPU, up to 45 TOPS
Available in Industrial Temperature Range
Cpu
Qualcomm Snapdragon X / X Plus / X Elite line of processors
in SiP-A, with Qualcomm Hexagon NPU, up to 45 TOPS
Graphiques
Qualcomm® Adreno™ GPU
• X1E-78-100 and X1P-64-100: Up to 3.8 TFLOPS
• X1P-42-100 and X1-26-100: Up to 1.7 TFLOPS
Connectivité
1x NBase-T Ethernet port
Mémoire
Up to 64GB LPDDR5 4224MT/s integrated
on SiP
Détails produit
Description
|
COM Express 3.1 Type 6 Compact modules with Qualcomm Snapdragon X / X Plus / X Elite line of processors in SiP-A, with Qualcomm Hexagon NPU, up to 45 TOPS |
|---|---|
Cpu
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Qualcomm Snapdragon X / X Plus / X Elite line of processors in SiP-A , with Qualcomm Hexagon NPU, up to 45 TOPS • Snapdragon X X1-26-100: 8 Cores Qualcomm® Oryon™ CPU @ 3.0 GHz, 30MB Cache • Snapdragon X Plus X1P-42-100: 8 Cores Qualcomm® Oryon™ CPU @ 3.2 GHz (3.4GHz Single Core Boost), 30MB Cache • Snapdragon X Plus X1P-64-100: 10 Cores Qualcomm® Oryon™ CPU @ 3.4 GHz, 42MB Cache • Snapdragon X Elite X1E-78-100: 12 Cores Qualcomm® Oryon™ CPU @ 3.4 GHz, 42MB Cache |
|
Mémoire
|
Up to 64GB LPDDR5 4224MT/s integrated on SiP |
|
Graphiques
|
Qualcomm® Adreno™ GPU • X1E-78-100 and X1P-64-100: Up to 3.8 TFLOPS • X1P-42-100 and X1-26-100: Up to 1.7 TFLOPS |
Interfaces vidéo
|
Up to 4 independent displays 2x DP supporting DP / DP Alt Mode overType-C 1x DDI supporting DP 1x eDP or 1 x LVDS Single/Dual Channel interfaces (factory alternatives) |
Résolution vidéo
|
DP: up to 5120x2880 @60Hz eDP up to 4K60Hz LVDS up to 1920x1200 @ 60Hz Max resolution 5120 × 2880p60 + 4096 × 2160p60 + 4096 × 2160p60 across all display outputs. |
Stockage masse
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UFS 4.0 module on-board, optional, up to 256GB microSD card slot I2C EEPROM |
Réseau
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1x NBase-T Ethernet port with Time-Sensitive Networking, supporting 10/100/1000/2500Mbps Intel® I226 Ethernet Controller |
Usb
|
2x USB 10Gbps interfaces (without USB hub) 1x USB 10Gbps + 3xUSB 5Gbps (with USB hub) 8x Hi-Speed USB 2x USB4 Gen3x2 ports |
|
Pci
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2x PCI-e x2 or 1x PCI-e x4 Gen4 port 1x PCI-e x2 Gen3 lport 1x PCI-e x8 Gen4 port on PEG pins |
Audio
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I2S audio interface on pins demanded to HD audio Soundwire interface |
Ports sériels
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Up to 2x 2-wires UARTs CAN port (optional) |
Autres Interfaces
|
Boot SPI General purpose SPI QSPI on LPC/eSPI 2x I2C Bus 4x GPIs 4x GPOs |
Alimentation
|
+12VDC ± 10%, +5V StandBy, +3.0VRTC |
Système d’exploitation
|
Microsoft® Windows 11 IoT Enterprise |
Température de fonctionnement
|
0° ÷ +60°C (Commercial Version) -40C ÷ +85°C (Industrial Version) |
Dimensions
|
95x95mm (COM Express Compact Form Factor) |
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