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COM Express®
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Computer on Module

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  1. Mass Storage
    onboard eMMC
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Cpu Maker
  1. MediaTek 1 item
  2. NXP 1 item
  3. Qualcomm 2 items
  4. Rockchip 1 item
Cpu Type
  1. MediaTek Genio 700 1 item
  2. NXP i.MX 95 1 item
  3. Qualcomm® QCS5430 1 item
  4. Qualcomm® QCS6490 1 item
  5. Rockchip RK3588 1 item
Ethernet
  1. ETHERNET≥1 5 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 4 items
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 4 items
  2. memory ≤16 1 item
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 1 item
  7. soldered down 3 items
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. I2C EEPROM 1 item
  5. M.2 NVMe SSD slot 5 items
  6. M.2 SATA SSD slot 3 items
  7. microSD card slot 5 items
  8. onboard eMMC 31 items
  9. onboard eMMC 5 items
  10. SATA channels ≥ 1 24 items
  11. SATA channels ≥ 1 1 item
  12. SATA channels ≥ 2 1 item
  13. SATA channels ≥ 2 4 items
  14. SATA channels ≥ 2 18 items
  15. SATA channels ≥ 3 3 items
  16. SATA channels ≥ 4 1 item
  17. SD interface 14 items
  18. SD interface 4 items
  19. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  20. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 4 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 4 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 3 items
  6. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 5 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 4 items
  3. USB 2.0 ≥ 3 4 items
  4. USB 2.0 ≥ 4 4 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.1 ≥ 1 3 items
  8. USB CLIENT 1 item
  9. USB OTG 1 item
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 3 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®