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COM Express®
COM-HPC®
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SMARC®
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Computer on Module

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  1. Mass Storage
    onboard SSD
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. NXP i.MX6 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 2 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 1 item
  5. soldered down 2 items
Mass Storage
  1. onboard SSD 2 items
  2. CFAST slot 1 item
  3. I2C EEPROM 1 item
  4. M.2 NVMe SSD slot 5 items
  5. M.2 SATA SSD slot 3 items
  6. microSD card slot 5 items
  7. onboard eMMC 37 items
  8. onboard eMMC 2 items
  9. SATA channels ≥ 1 29 items
  10. SATA channels ≥ 2 22 items
  11. SATA channels ≥ 2 1 item
  12. SATA channels ≥ 2 4 items
  13. SATA channels ≥ 3 3 items
  14. SATA channels ≥ 4 1 item
  15. SD interface 20 items
  16. SD interface 2 items
  17. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  18. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 1 item
  4. HDMI 2 items
  5. MIPI-CSI camera conn 1 item
  6. SINGLE CHANNEL LVDS 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®