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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
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Computer on Module

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  1. Cpu Maker
    Qualcomm
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Cpu Maker
  1. AMD 7 items
  2. Intel 25 items
  3. MediaTek 2 items
  4. NXP 16 items
  5. Qualcomm 6 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range < 5 W 1 item
Cpu Type
  1. Qualcomm Snapdragon 1 item
  2. Qualcomm® QCS5430 1 item
  3. Qualcomm® QCS6490 1 item
  4. Qualcomm Dragonwing IQ-X 1 item
  5. Qualcomm Dragonwing 1 item
  6. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 4 items
Form Factor
  1. COM Express® 2 items
  2. Myon MicroModule SOM 1 item
  3. SMARC 3 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. ≤ 100 x 100mm 3 items
  3. COM Express® 2 items
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. soldered down 4 items
  6. memory ≤32 1 item
  7. UFS 3.1 module on-board 1 item
  8. I2C EEPROM 2 items
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. soldered down 1 item
  2. I2C EEPROM 1 item
  3. onboard eMMC 1 item
  4. onboard eMMC 2 items
  5. SD interface 3 items
  6. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
  4. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 2 1 item
  8. USB 3.0 ≥ 4 1 item
  9. USB 3.1 ≥ 1 2 items
  10. USB OTG 1 item
Video Interfaces
  1. DP 4 items
  2. DUAL CHANNEL LVDS 4 items
  3. eDP 3 items
  4. MIPI-CSI camera conn 3 items
  5. MIPI-DSI 4 items
  6. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. /s/n/snapdragon-x_per_sito.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®