SOM-COM-HPC-A-Dragonwing-IQ10

In stock

COM-HPC® 1.3 Client Size A module based on Qualcomm Dragonwing™ IQ10 Series, with up to 700 TOPS of AI Acceleration.

Demander un devis

0,00 $US

Fiche technique

Cliquez pour télécharger

Clea OS

Visiter la page

Afficher toutes les ressources

Points forts

CPU
Dragonwing™ IQ10 Series: IQ-10800MD-AA and IQ-10800MD-AD

NPU
Up to 700 TOPS of AI Acceleration

Graphics
3x DisplayPort (DDI); 1x eDP; 5x CSI camera inputs

COM-HPC® 1.3 Client Size A module based on Qualcomm Dragonwing™ IQ10 Series, with up to 700 TOPS of AI Acceleration.

Security & Compliance by Design

SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.

Secure Boot

Built-in Secure Boot to ensure system integrity from the first startup.

OTA Updates

Remote and secure software update distribution for your devices.

Device Monitoring

Continuous monitoring of device status and activity with Clea.

Secure Operating System

Yocto-based OS integration for customizable and secure system builds.

Certified Security

Compliance with EN18031-1 standards for secure and reliable embedded systems.

Docker Technology

Isolated and flexible application management through containerization.

Application Hub

Découvrez les applications compatibles avec ce produit disponibles sur SECO Application Hub : des solutions prêtes à l'emploi pour accélérer le développement et le déploiement de fonctionnalités intelligentes.

Machine Alert Assistance with Operator Presence Detection

by NXP

AI-assisted HMI that detects operator presence during machine alerts and provides contextual troubleshooting information.

Industrial Safety Surveillance

CPU Description	Qualcomm Dragonwing™ IQ10 Series: IQ-10800MD-AA (64 GB memory) or IQ-10800MD-AD (32 GB memory)
Memory Description	Integrated LPDDR5x ECC memory: 64 GB (IQ-10800MD-AA) or 32 GB (IQ-10800MD-AD)
Graphics Description	Qualcomm® Adreno™ GPU
Video Interfaces Description	3x DDI (DisplayPort); 1x eDP
Video Resolution Description	4K @ 480 decode; 4K @ 240 encode
Mass Storage Description	UFS 4.0, 2 lanes, up to 512 GB; OSPI flash
Networking Description	2x NBASE-T Ethernet ports, each supporting 2.5GbE / 10GbE
USB Description	4x USB 2.0; Up to 4x USB SS
PCI Description	1x 8 Lanes PCIe Gen5 1x 4 Lanes PCIe Gen5 1x 2 Lanes PCIe Gen5 4x 1 Lane PCIe Gen3
Audio Description	I2S audio interface
Serial Ports	2x UART; 2x SPI; 1x general-purpose SPI
Other Interfaces	12x SoC GPIOs; 2x I2C; watchdog; fan and management signals; ACPI signals; RTC; Interfaces from internal SIL processor via bottom-side on-board connector
Operating System	Clea OS Microsoft Windows 11
Operating Temperature Description	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	120 x 95 mm (Com HPC Size A Form factor, Client pinout)