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SOM-COMe-CT6-Dragonwing-IQ9

SOM-COMe-CT6-Dragonwing-IQ9

COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)

/images/com_express/som-come-ct6-p100-front-main.jpg

SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

COM Express® Rel. Módulo 3.0 Compact Tipo 6 con procesadores Intel® Core™ y Celeron™ de 8.ª generación de la serie U (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)

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  1. Operating Temperature
    0°C ÷ +60°C
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Cpu Maker
  1. AMD 6 items
  2. Intel 12 items
  3. Qualcomm 2 items
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 8 items
  2. range < 10 W 2 items
  3. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 3 items
  4. Intel® Atom™ 4 items
  5. Intel® Celeron® 3 items
  6. Intel® Core™ 10 items
  7. Intel® Pentium® 3 items
  8. Intel® Xeon® 1 item
  9. Rockchip RK3588 1 item
  10. Qualcomm Dragonwing IQ-X 1 item
  11. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 18 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 10 items
  3. ≥ 100 x 100mm 4 items
  4. COM Express® 4 items
Form Factor Specification
  1. COM Express Basic 8 items
  2. COM Express Compact 12 items
Memory
  1. memory ≤1 12 items
  2. memory ≤16 11 items
  3. memory ≤2 12 items
  4. memory ≤4 12 items
  5. memory ≤8 12 items
  6. memory ≥32 14 items
  7. soldered down 2 items
  8. SO_DIMM 14 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 2 items
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. soldered down 1 item
  2. CFAST slot 1 item
  3. I2C EEPROM 1 item
  4. M.2 NVMe SSD slot 2 items
  5. M.2 SATA SSD slot 2 items
  6. microSD card slot 2 items
  7. onboard eMMC 3 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 10 items
  10. SATA channels ≥ 1 4 items
  11. SATA channels ≥ 2 1 item
  12. SATA channels ≥ 2 3 items
  13. SATA channels ≥ 2 13 items
  14. SATA channels ≥ 3 2 items
  15. SATA channels ≥ 4 1 item
  16. SD interface 1 item
  17. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  18. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 10 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 15 items
  4. 0°C ÷ +50°C 13 items
  5. 0°C ÷ +60°C 21 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 1 item
  8. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 13 items
  2. PCI-e lanes ≥ 2 13 items
  3. PCI-e lanes ≥ 3 13 items
  4. PCI-e lanes ≥ 4 14 items
  5. PCI-e lanes ≥ 5 18 items
Ttl Uarts
  1. TTL Uarts ≥1 13 items
  2. TTL Uarts ≥2 16 items
USB
  1. USB 2.0 ≥ 1 12 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 11 items
  4. USB 2.0 ≥ 4 11 items
  5. USB 2.0 ≥ 5 11 items
  6. USB 2.0 ≥ 6 14 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 9 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 3 items
  16. USB CLIENT 2 items
  17. USB OTG 4 items
Video Interfaces
  1. DDI 15 items
  2. DP 13 items
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 15 items
  5. eDP 18 items
  6. HDMI 15 items
  7. MIPI-CSI camera conn 4 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 14 items
  10. VGA 4 items
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item