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SOM-COMe-BT6-RPL-P
COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P).
(CALLISTO - E03)
Cpu
13th Gen Intel® Core™ processors targeted for IoT Applications
Gráficas
embedded Intel® Iris® Xe graphics with up to 96 execution units
Conectividad
1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.
Memoria
Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB
Datos del producto
Descripción
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COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P) |
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Cpu
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13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E:
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Memoria
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Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB |
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Gráfica
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Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K |
Interfaces vídeos
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Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives) |
Resolución vídeo
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HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920x1200 @ 60Hz |
Almacenamiento en masa
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2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4) |
Trabajo en red
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1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported. |
Usb
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Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports |
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Pci
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Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4 |
Audio
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HD audio and Soundwire/i2S audio interfaces |
Puertos de serie
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2x UARTs |
Otras interfaces
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SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO |
Alimentación eléctrica
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8VDC..20VDC, +5VSB (optional), +3VRTC (optional) |
Sistema operativo
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Microsoft® Windows 10 Linux Ubuntu |
Temperatura de funcionamiento
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0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensiones
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125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout) |
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