Menu
Account
COM Express®

Últimos productos

SOM-COMe-CT6-Dragonwing-IQ9

SOM-COMe-CT6-Dragonwing-IQ9

COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)

/images/com_express/som-come-ct6-p100-front-main.jpg

SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

COM Express® Rel. Módulo 3.0 Compact Tipo 6 con procesadores Intel® Core™ y Celeron™ de 8.ª generación de la serie U (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)

COM Express®

Shop By
Clear All

Items 1-6 of 7

Set Descending Direction
Página
per page
Shop By
Comprando ahora por
  1. Ethernet
    ETHERNET≥1
  2. USB
    USB 3.0 ≥ 4
Clear All
Shopping Options
Cpu Maker
  1. AMD 3 items
  2. Intel 3 items
  3. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 5 items
  2. range < 10 W 1 item
  3. range > 25 W 5 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 2 items
  3. Intel® Atom™ 1 item
  4. Intel® Celeron® 2 items
  5. Intel® Core™ 2 items
  6. Intel® Pentium® 1 item
  7. Intel® Xeon® 1 item
  8. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 7 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≥ 100 x 100mm 2 items
  3. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM Express Compact 5 items
Memory
  1. memory ≤1 5 items
  2. memory ≤16 4 items
  3. memory ≤2 4 items
  4. memory ≤4 5 items
  5. memory ≤8 5 items
  6. memory ≥32 5 items
  7. soldered down 1 item
  8. SO_DIMM 6 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 1 item
  3. microSD card slot 1 item
  4. onboard eMMC 1 item
  5. SATA channels ≥ 1 5 items
  6. SATA channels ≥ 2 1 item
  7. SATA channels ≥ 2 5 items
  8. SATA channels ≥ 3 1 item
  9. SATA channels ≥ 4 1 item
  10. SD interface 1 item
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 5 items
  4. 0°C ÷ +60°C 7 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 5 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 5 items
  4. PCI-e lanes ≥ 4 5 items
  5. PCI-e lanes ≥ 5 6 items
Ttl Uarts
  1. TTL Uarts ≥1 5 items
  2. TTL Uarts ≥2 7 items
USB
  1. USB 2.0 ≥ 1 12 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 11 items
  4. USB 2.0 ≥ 4 11 items
  5. USB 2.0 ≥ 5 11 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 8 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 3 8 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 3 items
  16. USB CLIENT 1 item
  17. USB OTG 2 items
Video Interfaces
  1. DDI 6 items
  2. DP 7 items
  3. DUAL CHANNEL LVDS 6 items
  4. eDP 7 items
  5. HDMI 6 items
  6. MIPI-CSI camera conn 2 items
  7. SINGLE CHANNEL LVDS 7 items
  8. VGA 2 items