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COM Express®
COM-HPC®
Qseven®
SMARC®
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Trizeps SODIMM (SOM)
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  1. Operating Temperature
    -20°C ÷ +70°C
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Cpu Maker
  1. Intel 2 items
  2. MediaTek 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 1 item
  5. MediaTek Genio 510 1 item
Form Factor
  1. COM Express® 2 items
  2. SMARC 1 item
Form Factor Specification
  1. COM Express Compact 2 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 2 items
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 3 items
  6. memory ≥32 2 items
  7. soldered down 1 item
  8. SO_DIMM 1 item
Mass Storage
  1. onboard eMMC 2 items
  2. SATA channels ≥ 1 2 items
  3. SATA channels ≥ 2 2 items
Operating Temperature
  1. -20°C ÷ +60°C 28 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 43 items
  4. 0°C ÷ +50°C 33 items
  5. 0°C ÷ +60°C 50 items
  6. 20°C ÷ +70°C 25 items
  7. -20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.1 ≥ 1 1 item
  8. USB 3.2 ≥ 1 1 item
  9. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 2 items
  5. HDMI 1 item
  6. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®