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COM Express®
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  1. Mass Storage
    SATA channels ≥ 2
  2. Pci Express
    PCI-e lanes ≥ 2
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Cpu Maker
  1. AMD 1 item
  2. Intel 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range > 25 W 1 item
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≥32 1 item
  2. SO_DIMM 2 items
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 3 items
  3. microSD card slot 2 items
  4. onboard eMMC 13 items
  5. onboard eMMC 3 items
  6. SATA channels ≥ 1 21 items
  7. SATA channels ≥ 2 2 items
  8. SATA channels ≥ 2 15 items
  9. SATA channels ≥ 3 3 items
  10. SATA channels ≥ 4 1 item
  11. SD interface 6 items
  12. SD interface 3 items
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 3 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 6 1 item
  6. USB 3.2 ≥ 1 1 item
  7. USB 4.0 ≥ 1 1 item
  8. USB 4.0 ≥ 2 1 item
  9. USB 4.0 ≥ 3 1 item
  10. USB 4.0 ≥ 4 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 1 item
  5. eDP 2 items
  6. HDMI 2 items
  7. MIPI-DSI 1 item
  8. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®