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COM Express®
COM-HPC®
Qseven®
SMARC®
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  1. Mass Storage
    SD interface
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Cpu Maker
  1. AMD 1 item
  2. Intel 4 items
  3. NXP 9 items
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 9 items
  3. range > 25 W 1 item
Cpu Type
  1. Intel® Atom™ 3 items
  2. Intel® Celeron® 4 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 3 items
  5. Intel® Xeon® 1 item
  6. NXP i.MX 8M 1 item
  7. NXP i.MX 8M Mini 1 item
  8. NXP i.MX 8M Nano 1 item
  9. NXP i.MX 8M Plus 1 item
  10. NXP i.MX 8X 1 item
  11. NXP i.MX 933/935 1 item
  12. NXP i.MX6 3 items
  13. NXP i.MX8 1 item
  14. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 11 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 7 items
  3. SMARC 6 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 items
  3. ≤ 100 x 100mm 9 items
  4. ≤ 80 x 80mm 11 items
  5. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. Qseven 70x70 mm 4 items
  3. µQseven 70x40 3 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 13 items
  2. memory ≤16 2 items
  3. memory ≤2 13 items
  4. memory ≤4 11 items
  5. memory ≤8 5 items
  6. memory ≥32 1 item
  7. soldered down 12 items
  8. SO_DIMM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. I2C EEPROM 1 item
  5. M.2 NVMe SSD slot 5 items
  6. M.2 SATA SSD slot 3 items
  7. microSD card slot 5 items
  8. onboard eMMC 31 items
  9. onboard eMMC 6 items
  10. SATA channels ≥ 1 23 items
  11. SATA channels ≥ 1 2 items
  12. SATA channels ≥ 2 1 item
  13. SATA channels ≥ 2 4 items
  14. SATA channels ≥ 2 18 items
  15. SATA channels ≥ 3 3 items
  16. SATA channels ≥ 4 1 item
  17. SD interface 14 items
  18. SD interface 4 items
  19. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  20. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 8 items
  2. -40°C ÷ +85°C 12 items
  3. 0°C ÷ +50°C 10 items
  4. 0°C ÷ +60°C 14 items
  5. 20°C ÷ +70°C 9 items
Pci Express
  1. PCI-e lanes ≥ 1 12 items
  2. PCI-e lanes ≥ 2 6 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 5 items
  5. PCI-e lanes ≥ 5 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 10 items
  2. TTL Uarts ≥2 9 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 12 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 9 items
  4. USB 2.0 ≥ 4 8 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 8 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.2 ≥ 2 1 item
  12. USB OTG 8 items
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DP++ 3 items
  4. DUAL CHANNEL LVDS 12 items
  5. eDP 6 items
  6. HDMI 10 items
  7. MIPI-CSI camera conn 3 items
  8. MIPI-DSI 4 items
  9. SINGLE CHANNEL LVDS 12 items
  10. VGA 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 5 items
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®