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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computadora embebida sin ventilador con los procesadores Intel® Core™ de 11ª generación y los Intel® Celeron® SoCs (Codename: Tiger Lake UP3) más el chip de inteligencia artificial Axelera: alimentado por un solo Metis AIPU de hasta 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Ordenador integrado sin ventilador con los SoCs Intel® Core™ e Intel® Celeron® de 11.ª generación (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Ordenador integrado sin ventilador con los SoCs Intel® Atom® Serie X6000E, Intel® Pentium® y Celeron® Serie N y J (codename: Elkhart Lake). (PYXIS - SYS-D63-IPC)

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  1. Intel 6 items
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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 4 items
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  1. Espressif ESP32-D0WD 1 item
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  6. NXP i.MX 8M 1 item
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  8. Rockchip RK3399 1 item
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  2. ETHERNET≥2 9 items
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  2. Boxed Solutions 10 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 5 items
Form Factor Specification
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Memory
  1. memory ≤1 11 items
  2. memory ≤16 4 items
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  4. memory ≤4 9 items
  5. memory ≤8 8 items
  6. memory ≥32 4 items
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  8. SO_DIMM 4 items
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  2. M.2 SATA SSD slot 4 items
  3. microSD card slot 1 item
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  5. onboard eMMC 2 items
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  9. SATA channels ≥ 4 2 items
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  2. -20°C ÷ +70°C 1 item
  3. 0°C ÷ +50°C 9 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 3 items
  6. -20°C ÷ +70°C 1 item
  7. -20°C ÷ +70°C 1 item
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  1. PCI-e lanes ≥ 1 1 item
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  1. DP 4 items
  2. DP++ 3 items
  3. HDMI 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 6 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 4 items