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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordenador integrado sin ventilador basado en el procesador de aplicaciones Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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Cpu Maker
  1. AMD 2 items
  2. Arm System ready NXP 1 item
  3. MediaTek 1 item
  4. NXP 19 items
  5. Qualcomm 1 item
  6. Rockchip 2 items
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 11 items
  3. range < 5 W 3 items
  4. range > 25 W 1 item
Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. NXP i.MX 8M 2 items
  3. NXP i.MX 8M Mini 6 items
  4. NXP i.MX 8M Nano 3 items
  5. NXP i.MX 8M Plus 2 items
  6. NXP i.MX 8X 2 items
  7. NXP i.MX 933/935 1 item
  8. NXP i.MX6 5 items
  9. NXP i.MX8 2 items
  10. Rockchip RK3399 1 item
  11. Rockchip RK3568 1 item
  12. Zynq® Ultras 1 item
  13. MediaTek Genio360 1 item
  14. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 22 items
  2. ETHERNET≥2 13 items
Form Factor
  1. COM Express® 1 item
  2. Myon MicroModule SOM 1 item
  3. Qseven 5 items
  4. SMARC 6 items
  5. Trizeps SODIMM SOM 3 items
  6. Single Board Computer 1 item
  7. Single Board Computer 9 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 3 items
  5. ≤ 100 x 100mm 10 items
  6. ≤ 80 x 80mm 9 items
  7. ≥ 100 x 100mm 5 items
Form Factor Specification
  1. 3,5" 5 items
  2. COM Express Compact 1 item
  3. Other SBCs 4 items
  4. Qseven 70x70 mm 3 items
  5. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 22 items
  2. memory ≤2 21 items
  3. memory ≤4 18 items
  4. memory ≤8 6 items
  5. memory ≥32 1 item
  6. soldered down 16 items
  7. SO_DIMM 1 item
  8. memory ≤32 1 item
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 8 items
  3. onboard eMMC 2 items
  4. onboard eMMC 18 items
  5. onboard eMMC 4 items
  6. SATA channels ≥ 1 3 items
  7. SATA channels ≥ 2 1 item
  8. SD interface 9 items
  9. SD interface 4 items
  10. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 12 items
  2. -40°C ÷ +85°C 18 items
  3. 0°C ÷ +50°C 15 items
  4. 0°C ÷ +60°C 21 items
  5. 20°C ÷ +70°C 12 items
Pci Express
  1. PCI-e lanes ≥ 1 11 items
  2. PCI-e lanes ≥ 2 4 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 17 items
  2. TTL Uarts ≥2 16 items
  3. TTL Uarts ≥3 12 items
USB
  1. USB 2.0 ≥ 1 20 items
  2. USB 2.0 ≥ 2 19 items
  3. USB 2.0 ≥ 3 11 items
  4. USB 2.0 ≥ 4 9 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 11 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 4 1 item
  10. USB OTG 16 items
Video Interfaces
  1. DDI 1 item
  2. DP 9 items
  3. DUAL CHANNEL LVDS 26 items
  4. eDP 12 items
  5. HDMI 20 items
  6. MIPI-CSI camera conn 6 items
  7. MIPI-DSI 11 items
  8. PARALLEL RGB 4 items
  9. SINGLE CHANNEL LVDS 26 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. M.2 SOCKET 2 KEY 4 items
  3. ONBOARD WI-FI/BLE 10 items
  4. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item