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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors

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SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor

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Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

Titan 225 RK3399

Titan 225 RK3399

Ordenador integrado sin ventilador basado en el procesador de aplicaciones Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Form Factor Dimensions
    67,6 x 36,7 mm
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Cpu Maker
  1. MediaTek 1 item
  2. NXP 4 items
Cpu Power Consumption
  1. range < 5 W 4 items
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8M Mini 1 item
  3. NXP i.MX 8M Plus 1 item
  4. NXP i.MX6 1 item
  5. MediaTek Genio360 1 item
Ethernet
  1. ETHERNET≥1 5 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 5 items
  5. ≤ 100 x 100mm 15 items
  6. ≤ 80 x 80mm 9 items
  7. ≥ 100 x 100mm 11 items
  8. COM Express® 1 item
Memory
  1. memory ≤1 5 items
  2. memory ≤2 5 items
  3. memory ≤4 4 items
  4. memory ≤8 3 items
Mass Storage
  1. onboard eMMC 1 item
  2. onboard eMMC 4 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 5 items
  2. TTL Uarts ≥2 5 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 1 3 items
  4. USB 3.0 ≥ 2 3 items
  5. USB OTG 1 item
Video Interfaces
  1. DUAL CHANNEL LVDS 1 item
  2. HDMI 2 items
  3. MIPI-DSI 4 items
  4. PARALLEL RGB 4 items
  5. SINGLE CHANNEL LVDS 3 items