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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computadora embebida sin ventilador con los procesadores Intel® Core™ de 11ª generación y los Intel® Celeron® SoCs (Codename: Tiger Lake UP3) más el chip de inteligencia artificial Axelera: alimentado por un solo Metis AIPU de hasta 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor

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    ≤ 80 x 80mm
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Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
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  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 933/935 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. ≤ 100 x 100mm 6 items
  3. ≤ 80 x 80mm 2 items
Memory
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  2. memory ≤2 2 items
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 2 items
Mass Storage
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  2. SATA channels ≥ 1 1 item
  3. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
Ttl Uarts
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  3. TTL Uarts ≥3 2 items
USB
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  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
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  9. USB OTG 1 item
Video Interfaces
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  2. DUAL CHANNEL LVDS 1 item
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  6. MIPI-DSI 2 items
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Wireless Connectivity
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