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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. Operating Temperature
    0°C ÷ +60°C
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Cpu Maker
  1. AMD 6 items
  2. Intel 16 items
  3. MediaTek 2 items
  4. NVIDIA 1 item
  5. NXP 9 items
  6. Qualcomm 3 items
Cpu Power Consumption
  1. range 10-25 W 10 items
  2. range < 10 W 13 items
  3. range > 25 W 4 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 3 items
  3. Intel® Atom™ 13 items
  4. Intel® Celeron® 8 items
  5. Intel® Core™ 5 items
  6. Intel® Pentium® 8 items
  7. MediaTek Genio 510 1 item
  8. MediaTek Genio 700 1 item
  9. NVIDIA Tegra® T30 1 item
  10. NXP i.MX 8M 2 items
  11. NXP i.MX 8M Mini 1 item
  12. NXP i.MX 8M Nano 1 item
  13. NXP i.MX 8M Plus 1 item
  14. NXP i.MX 8X 1 item
  15. NXP i.MX 95 1 item
  16. NXP i.MX6 2 items
  17. NXP i.MX8 1 item
  18. Qualcomm® QCS5430 1 item
  19. Qualcomm® QCS6490 1 item
  20. Zynq® Ultras 1 item
  21. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 29 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 10 items
  2. Qseven 6 items
  3. SMARC 13 items
  4. Single Board Computer 1 item
  5. Single Board Computer 7 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 6 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 items
  3. ≤ 100 x 100mm 37 items
  4. ≤ 80 x 80mm 17 items
  5. ≥ 100 x 100mm 27 items
  6. COM Express® 4 items
Form Factor Specification
  1. COM Express Compact 10 items
  2. Other SBCs 2 items
  3. Pico-ITX 6 items
  4. Qseven 70x70 mm 5 items
  5. µQseven 70x40 1 item
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 28 items
  2. memory ≤16 14 items
  3. memory ≤2 28 items
  4. memory ≤4 26 items
  5. memory ≤8 20 items
  6. memory ≥32 6 items
  7. soldered down 23 items
  8. SO_DIMM 8 items
  9. memory ≤32 1 item
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 2 items
  3. standard SATA connector 5 items
  4. M.2 SATA SSD slot 6 items
  5. microSD card slot 5 items
  6. onboard eMMC 1 item
  7. onboard eMMC 20 items
  8. onboard eMMC 7 items
  9. SATA channels ≥ 1 18 items
  10. SATA channels ≥ 1 2 items
  11. SATA channels ≥ 2 2 items
  12. SATA channels ≥ 2 8 items
  13. SD interface 10 items
  14. SD interface 4 items
  15. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 24 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 27 items
  4. 0°C ÷ +50°C 25 items
  5. 0°C ÷ +60°C 37 items
  6. 20°C ÷ +70°C 23 items
  7. -20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 23 items
  2. PCI-e lanes ≥ 2 18 items
  3. PCI-e lanes ≥ 3 13 items
  4. PCI-e lanes ≥ 4 15 items
  5. PCI-e lanes ≥ 5 10 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 24 items
  2. TTL Uarts ≥2 25 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 27 items
  2. USB 2.0 ≥ 2 26 items
  3. USB 2.0 ≥ 3 25 items
  4. USB 2.0 ≥ 4 20 items
  5. USB 2.0 ≥ 5 17 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 15 items
  8. USB 3.0 ≥ 2 14 items
  9. USB 3.0 ≥ 3 6 items
  10. USB 3.0 ≥ 4 3 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 4 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 3 items
  15. USB OTG 11 items
Video Interfaces
  1. DDI 9 items
  2. DP 14 items
  3. DP++ 8 items
  4. DUAL CHANNEL LVDS 27 items
  5. eDP 24 items
  6. HDMI 24 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 6 items
  9. SINGLE CHANNEL LVDS 24 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 7 items
  2. M.2 SOCKET 2 KEY 1 item
  3. M.2 Socket 2 key B 3 items
  4. ONBOARD WI-FI/BLE 9 items
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution