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  1. Form Factor
    COM Express®
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Cpu Maker
  1. AMD 6 items
  2. Intel 13 items
  3. Qualcomm 2 items
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 9 items
  2. range < 10 W 2 items
  3. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 3 items
  4. Intel® Atom™ 4 items
  5. Intel® Celeron® 4 items
  6. Intel® Core™ 11 items
  7. Intel® Pentium® 3 items
  8. Intel® Xeon® 1 item
  9. Rockchip RK3588 1 item
  10. Qualcomm Dragonwing IQ-X 1 item
  11. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 20 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 23 items
  2. COM-HPC® 7 items
  3. ESP32 2 items
  4. Myon MicroModule SOM 4 items
  5. Qseven 9 items
  6. Single Board Compute 2 items
  7. SMARC 19 items
  8. Trizeps SODIMM SOM 11 items
  9. Boxed Solutions 16 items
  10. Modular HMIs 15 items
  11. Single Board Computer 4 items
  12. Single Board Computer 22 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 4 items
  2. ≤ 100 x 100mm 11 items
  3. ≥ 100 x 100mm 4 items
  4. COM Express® 4 items
Form Factor Specification
  1. COM Express Basic 9 items
  2. COM Express Compact 13 items
Memory
  1. memory ≤1 12 items
  2. memory ≤16 12 items
  3. memory ≤2 13 items
  4. memory ≤4 13 items
  5. memory ≤8 13 items
  6. memory ≥32 15 items
  7. soldered down 2 items
  8. SO_DIMM 15 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 2 items
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. soldered down 1 item
  2. CFAST slot 1 item
  3. I2C EEPROM 1 item
  4. M.2 NVMe SSD slot 2 items
  5. M.2 SATA SSD slot 2 items
  6. microSD card slot 4 items
  7. onboard eMMC 6 items
  8. onboard eMMC 1 item
  9. SATA channels ≥ 1 14 items
  10. SATA channels ≥ 1 1 item
  11. SATA channels ≥ 2 1 item
  12. SATA channels ≥ 2 4 items
  13. SATA channels ≥ 2 14 items
  14. SATA channels ≥ 3 3 items
  15. SATA channels ≥ 4 1 item
  16. SD interface 1 item
  17. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  18. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 10 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 15 items
  4. 0°C ÷ +50°C 13 items
  5. 0°C ÷ +60°C 22 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 14 items
  2. PCI-e lanes ≥ 2 14 items
  3. PCI-e lanes ≥ 3 14 items
  4. PCI-e lanes ≥ 4 16 items
  5. PCI-e lanes ≥ 5 19 items
Ttl Uarts
  1. TTL Uarts ≥1 13 items
  2. TTL Uarts ≥2 16 items
USB
  1. USB 2.0 ≥ 1 13 items
  2. USB 2.0 ≥ 2 12 items
  3. USB 2.0 ≥ 3 12 items
  4. USB 2.0 ≥ 4 12 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 9 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 7 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 3 items
  16. USB CLIENT 2 items
  17. USB OTG 4 items
Video Interfaces
  1. DDI 16 items
  2. DP 14 items
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 16 items
  5. eDP 19 items
  6. HDMI 16 items
  7. MIPI-CSI camera conn 4 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 15 items
  10. VGA 5 items
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution